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HB526A264DB

Features: · 144-pin Zig Zag Dual tabs socket type-Outline: 67.60 mm (Length) × 25.40 mm (Height) ×3.80 mm (Thickness)-Lead pitch: 0.80 mm· 3.3V power supply· Clock frequency: 100 MHz / 83 MHz· LVTTL interface· 2 Banks can operates simultaneously and independently· Burst read/write operation and bu...

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SeekIC No. : 004358824 Detail

HB526A264DB: Features: · 144-pin Zig Zag Dual tabs socket type-Outline: 67.60 mm (Length) × 25.40 mm (Height) ×3.80 mm (Thickness)-Lead pitch: 0.80 mm· 3.3V power supply· Clock frequency: 100 MHz / 83 MHz· LVTTL...

HB526A264DB Data Sheet

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Part Number:
HB526A264DB
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/30

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Product Details

Description



Features:

·  144-pin Zig Zag Dual tabs socket type
- Outline: 67.60 mm (Length) × 25.40 mm (Height) ×3.80 mm (Thickness)
- Lead pitch: 0.80 mm
·  3.3V power supply
·  Clock frequency: 100 MHz / 83 MHz
·  LVTTL interface
·  2 Banks can operates simultaneously and independently
·  Burst read/write operation and burst read/single write operation capability
·  Programmable burst length : 1/2/4/8/full page
·  Programmable burst sequence
- Sequential/interleave
·  Full page burst length capability
- Sequential burst
-Burst stop capability
·  Programmable CAS latency : 2/3
·  Byte control by DQMB


Pinout

Parameter Symbol Value Unit
Voltage on any pin relative to VSS VT 1.0 to +4.6 V
Supply voltage relative to VSS VCC 1.0 to +4.6 V
Short circuit output current Iout 50 mA
Power dissipation PT 8.0 W
Operating temperature Topr 0 to +70
Storage temperature Tstg 55 to +125
Note: 1. Respect to VSS.


Description

The HB526A264DB is a 1M× 64 × 2 banks Synchronous Dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit SDRAM (HM5216805TT/HM5216805LTT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). An outline of the HB526A264DB is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB526A264DB makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted beside TSOP on the module board.




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