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HB526C464EN-10IN

Features: · 168-pin socket type package (dual lead out)-Outline: 133.37 mm (Length) × 31.75 mm (Height) × 2.92/4.00 mm (Thickness)-Lead pitch: 1.27 mm· 3.3V power supply· Clock frequency: 66 MHz· JEDEC standard outline unbuffered 8-byte DIMM· LVTTL interface· Data bus width: × 64 Non parity· 2 Ban...

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SeekIC No. : 004358830 Detail

HB526C464EN-10IN: Features: · 168-pin socket type package (dual lead out)-Outline: 133.37 mm (Length) × 31.75 mm (Height) × 2.92/4.00 mm (Thickness)-Lead pitch: 1.27 mm· 3.3V power supply· Clock frequency: 66 MHz· JE...

HB526C464EN-10IN Data Sheet

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Part Number:
HB526C464EN-10IN
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/17

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Product Details

Description



Features:

·  168-pin socket type package (dual lead out)
- Outline: 133.37 mm (Length) × 31.75 mm (Height) × 2.92/4.00 mm (Thickness)
- Lead pitch: 1.27 mm
·  3.3V power supply
·  Clock frequency: 66 MHz
·  JEDEC standard outline unbuffered 8-byte DIMM
·  LVTTL interface
·  Data bus width: × 64 Non parity
·  2 Banks can operates simultaneously and independently
·  Burst read/write operation and burst read/single write operation capability
·  Programmable burst length: 1/2/4/8/full page
·  Programmable burst sequence
- Sequential/interleave


Specifications

Parameter Symbol Value Unit Note
Voltage on any pin relative to VSS VT 0.5 to +4.6 V 1
Supply voltage relative to VSS VDD 0.5 to +4.6 V 1
Operating temperature Topr 0 to +65
Storage temperature Tstg 55 to +125
Note: 1. Respect to VSS



Description

The HB526C264EN, HB526C464EN belong to 8-byte DIMM (Dual In-line Memory Module) family, and have been developed as an optimized main memory solution for 8-byte processor applications. The HB526C264EN is a 1M × 64× 2-bank Synchronous Dynamic RAM Module, mounted 8 pieces of 16- Mbit SDRAM (HM5216805TT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The HB526C464EN is a 1M × 64 × 4-bank Synchronous Dynamic RAM Module, mounted 16 pieces of 16-Mbit SDRAM (HM5216805TT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). An outline of the HB526C264EN, HB526C464EN are 168-pin socket type package (dual lead out). Therefore, the HB526C264EN, HB526C464EN make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the module board.




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