Features: · 168-pin socket type package (dual lead out)-Outline: 133.37 mm (Length) × 31.75 mm (Height) × 2.92/4.00 mm (Thickness)-Lead pitch: 1.27 mm· 3.3V power supply· Clock frequency: 66 MHz· JEDEC standard outline unbuffered 8-byte DIMM· LVTTL interface· Data bus width: × 64 Non parity· 2 Ban...
HB526C264EN-10IN: Features: · 168-pin socket type package (dual lead out)-Outline: 133.37 mm (Length) × 31.75 mm (Height) × 2.92/4.00 mm (Thickness)-Lead pitch: 1.27 mm· 3.3V power supply· Clock frequency: 66 MHz· JE...
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Features: · 144-pin Zig Zag Dual tabs socket type-Outline: 67.60 mm (Length) × 25.40 mm (Height) ×...
Features: · 144-pin Zig Zag Dual tabs socket type-Outline: 67.60 mm (Length) × 25.40 mm (Height) ×...
Features: · 168-pin socket type package (dual lead out)-Outline: 133.35 mm (Length) × 25.40 mm (He...
Parameter | Symbol | Value | Unit | Note |
Voltage on any pin relative to VSS | VT | 0.5 to +4.6 | V | 1 |
Supply voltage relative to VSS | VDD | 0.5 to +4.6 | V | 1 |
Operating temperature | Topr | 0 to +65 | ||
Storage temperature | Tstg | 55 to +125 |
The HB526C264EN, HB526C464EN belong to 8-byte DIMM (Dual In-line Memory Module) family, and have been developed as an optimized main memory solution for 8-byte processor applications. The HB526C264EN is a 1M × 64× 2-bank Synchronous Dynamic RAM Module, mounted 8 pieces of 16- Mbit SDRAM (HM5216805TT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The HB526C464EN is a 1M × 64 × 4-bank Synchronous Dynamic RAM Module, mounted 16 pieces of 16-Mbit SDRAM (HM5216805TT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). An outline of the HB526C264EN, HB526C464EN are 168-pin socket type package (dual lead out). Therefore, the HB526C264EN, HB526C464EN make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the module board.