GP2400ESM18

Features:

·High Thermal Cycling Capability
·Non Punch Through Silicon
·Isolated MMC Base with AlN Substrates
·2400A Per Module


Application

·High Reliability Inverters
·Motor Controllers
·Traction Drives
·Resonant Converters


Specifications

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

T_case = 25°C unless stated otherwise

Symbol	Parameter	Conditions	Ratings	Unit
VCES	Collector-emitter voltage	VGE = 0V	1800	V
VGES	Gate-emitter voltage		±20	V
IC	Continuous collector current	Tcase = 65°C	2400	A
IC(PK)	Peak collector current	1ms, Tcase = 110°C	4800	A
Pmax	Max. transistor power dissipation	Tcase = 25°C, Tvj = 150°C	20.8	KW
Visol	Isolation voltage	Commoned terminals to base plate. AC RMS, 1 min, 50Hz	4000	°C

Description

The powerline range of high power modules GP2400ESM18 includes dual and single switch configurations covering voltages from 600V to 3300V and currents up to 4800A.

The GP2400ESM18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. This device is optimised for traction drives and other applications requiring high thermal cycling capability or very high reliability.

The GP2400ESM18 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety.