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GP1200FSS18

Features: Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1200A Per ModuleApplication High Power Inverters Motor Controllers Induction Heating Resonant ConvertersPinoutSpecifications Symbol Parameter Test Conditions Max. Units VCES Collector...

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SeekIC No. : 004354891 Detail

GP1200FSS18: Features: Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1200A Per ModuleApplication High Power Inverters Motor Controllers Induction Heating Resonant Conv...

GP1200FSS18 Data Sheet

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Part Number:
GP1200FSS18
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/22

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Product Details

Description



Features:

Non Punch Through Silicon
Isolated Copper Baseplate
Low Inductance Internal Construction
1200A Per Module


Application

High Power Inverters
Motor Controllers
Induction Heating
Resonant Converters


Pinout

Connection Diagram


Specifications

Symbol Parameter Test Conditions Max. Units
VCES Collector-emitter voltage VGE = 0V 1800 V
VCES Gate-emitter voltage   ±20 V
IC Continuous collector current Tcase = 50˚C 1200 A
IC(PK) Peak collector current 1ms, Tcase = 110˚C 2400 A
Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 8.5 kW
Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 4000 V



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