GP1200ESM33

Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN SubstratesApplication High Reliability Inverters Motor Controllers Traction Drives Resonant ConvertersPinoutSpecifications Symbol Parameter Test Conditions Max. Units VCES Collector-emitt...

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GP1200ESM33 Picture
SeekIC No. : 004354889 Detail

GP1200ESM33: Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN SubstratesApplication High Reliability Inverters Motor Controllers Traction Drives Resonant Converters...

floor Price/Ceiling Price

Part Number:
GP1200ESM33
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/22

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Product Details

Description



Features:

High Thermal Cycling Capability
Non Punch Through Silicon
Isolated MMC Base with AlN Substrates



Application

High Reliability Inverters
Motor Controllers
Traction Drives
Resonant Converters



Pinout

  Connection Diagram


Specifications

Symbol Parameter Test Conditions Max. Units
VCES Collector-emitter voltage VGE = 0V 1800 V
VCES Gate-emitter voltage   ±20 V
IC Continuous collector current Tcase = 70°C for Tj = 125°C 1600 A
IC(PK) Peak collector current 1ms, Tcase = 120˚C 2400 A
Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 14.7 kW
Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 6000 V



Description

The Powerline range of high power modules GP1200ESM33 includes dual and single switch configurations covering voltages from 1200V to 3300V and currents up to 4800A.

The GP1200ESM33 is a single switch 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. This device is optimised for traction drives and other applications requiring high thermal cycling capability or very high reliability.

The GP1200ESM33 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.


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