Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN SubstratesApplication High Reliability Inverters Motor Controllers Traction Drives Resonant ConvertersPinoutSpecifications Symbol Parameter Test Conditions Max. Units VCES Collector-emitt...
GP1200ESM33: Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN SubstratesApplication High Reliability Inverters Motor Controllers Traction Drives Resonant Converters...
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Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Su...
Features: Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Constructio...
Features: Low VCE(SAT) Non Punch Through SiliconIsolated Copper Baseplate Low Inductance Internal...
Symbol | Parameter | Test Conditions | Max. | Units |
VCES | Collector-emitter voltage | VGE = 0V | 1800 | V |
VCES | Gate-emitter voltage | ±20 | V | |
IC | Continuous collector current | Tcase = 70°C for Tj = 125°C | 1600 | A |
IC(PK) | Peak collector current | 1ms, Tcase = 120˚C | 2400 | A |
Pmax | Max. transistor power dissipation | Tcase = 25˚C, Tj = 150˚C | 14.7 | kW |
Visol | Isolation voltage | Commoned terminals to base plate. AC RMS, 1 min, 50Hz | 6000 | V |