DS3832C-311

Features:

  3.0V to 3.6V operation
   Surface-mount nonvolatile (NV) RAM ball-gridarray (BGA) module construction
   1024k x 32 NV SRAM memory space andseparate 64 x 8 real-time clock (RTC)memory space
   RTC maintains hundredths of seconds,seconds, minutes, hours, day, date, month,and year with leap-year compensation validup to 2100
   Removable backup power source providesmore than eight years of timekeeping anddata retention
   Read and write access times as fast as 100ns forNV SRAM memory and 200ns for RTC
   Automatic data protection during power loss
   Unlimited write-cycle endurance
   Low-power CMOS operation
   Battery monitor checks remaining capacity daily
   Industrial temperature range of -40 to+85



Specifications

Voltage on Any Pin Relative to Ground......................... -0.3 to +4.6 V
Operating Temperature Range .....................................-40 to +85
Storage Temperature Range...................................... ..-40 to +85
Soldering Temperature ..........See IPC/JEDEC J-STD-020A Specification


Description

The DS3832C-311 is a 1,048,576 x 32 advanced NV SRAM module with a 168-bump BGA pinout. Thehighly integrated DS3832C-311 contains a 64-byte RTC, four 8Mb SRAMs, and control circuitry thatconstantly monitors V_CC for an out-of-tolerance condition. When such a condition occurs, the DS3832C-311 makes use of an attached DS3802 battery cap to maintain clock information and preserve stored datawhile protecting that data by disallowing all memory accesses. Additionally, the DS3832C-311 hasdedicated circuitry for monitoring the status of V_CC and the status of an attached DS3802 battery cap.