DS3800

Features:

  Houses 400 mAh primary lithium battery
  Snaps directly onto a surfacemounted 40mmballgrid array (BGA) Nonvolatile SRAMmodule
  Attaches after host BGA module has beensurfacemounted to protect lithium batteryfrom the high temperatures of reflowsoldering
  Maintains mechanical and electricalconnection with BGA module even duringsevere shock and vibration stresses
  Four attachment flanges latch onto host BGAmodule to provide strong, semipermanentattachment.  Flanges can be broken off for capremoval
  Industrial temperature range of 40to+85


Pinout




Specifications

Operating Temperature ...........................-40 to 85
Non-Operating Temperature ....................-40 to 85


Description

The DS3800 Battery Cap is a snapon lithium power source for Dallas Semiconductors 40mm ballgridarray (BGA) Nonvolatile SRAM modules. After a host BGA module has been soldered in place andcleaned, the DS3800 Battery Cap is snapped onto the module to serve as the secondary power supply.The Battery Cap is keyed to prevent incorrect attachment and is designed to maintain mechanical andelectrical contact with its host module even during severe shock and vibration. Electrically, the DS3800battery is connected to the host BGA module with goldplated round pins in the Battery Cap inserted intogoldplated receptacles on the BGA. Mechanically, four flanges on the DS3800 tightly grip the BGAmodule board to prevent Cap removal, while corner features in the Cap prevent lateral movement of theCap while it is attached to its host BGA module.