Features: ` 10s Short Circuit Withstand` Soft Punch Through Silicon` Isolated AlSiC Base with AlN substrates` High thermal cycling capabilityApplication· Choppers· Motor Controllers· Power Supplies· Traction AuxiliariesSpecificationsStresses above those listed under 'Absolute Maximum Ratings' may ...
DIM200PKM33-F000: Features: ` 10s Short Circuit Withstand` Soft Punch Through Silicon` Isolated AlSiC Base with AlN substrates` High thermal cycling capabilityApplication· Choppers· Motor Controllers· Power Supplies·...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Features: 10s Short Circuit WithstandNon Punch Through SiliconIsolated Copper BaseApplicationInver...
Features: 10s Short Circuit WithstandHigh Thermal Cycling CapabilityNon Punch Through SiliconIsola...
Symbol | Parameter | Test Conditions |
Max. |
Units |
VCES | Collector-emitter voltage | VGE = 0V |
3300 |
V |
VGES | Gate-emitter voltage |
±20 |
V | |
IC | Continuous collector current | Tcase =90˚C |
200 |
A |
IC(PK) | Peak collector current | 1ms, Tcase = 115˚C |
400 |
A |
Pmax | Max. transistor power dissipation | Tcase = 25˚C, Tj = 150˚C |
2.6 |
W |
I2t | Diode I2t value (IGBT arm) | VR = 0, tp = 10ms, Tvj = 125˚C |
20
|
kA2S |
Diode I2t value (Diode arm) |
20 | |||
Visol | Isolation voltage - per module | Commoned terminals to base plate. AC RMS,1 min, 50Hz |
6000 |
V |
QPD | Partial discharge - per module | IEC1287. V1 = 3500V, V2 = 2600V, 50Hz RMS |
10 |
PC |
The Powerline range of high power modules includes half bridge, chopper, dual, single and bidirectional switch configurations covering voltagesfrom 600V to 3300V and currents up to 2400A.
The DIM200PKM33-F000 is a 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module configured with the upper arm of the bridge controlled. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10s short circuit withstand. This device is optimised for traction drives and other applications requiring high thermal cycling capability.
The module DIM200PKM33-F000 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.