CxxxXR230-Sxx00-x Selling Leads, Price trend, CxxxXR230-Sxx00-x DataSheet download, circuit diagram from SeekIC.com

Features: ` XT Rectangular LED Performance` 460 nm & 470 nm` XR-18™ 18.0 mW min.` XR-21™ 21.0 mW min.` Thin 150 m Chip` Low Forward Voltage 3.2 Typical at 20 mA` Single Wire Bond Structure` Class 2 ESD Rating` Sn Contact for Low-Temp. Die Attach Methods` Die Attach Options:` Flu...

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SeekIC No. : 004319094 Detail

CxxxXR230-Sxx00-x: Features: ` XT Rectangular LED Performance` 460 nm & 470 nm` XR-18™ 18.0 mW min.` XR-21™ 21.0 mW min.` Thin 150 m Chip` Low Forward Voltage 3.2 Typical at 20 mA` Single Wire Bond ...

CxxxXR230-Sxx00-x Data Sheet

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Part Number:: CxxxXR230-Sxx00-x
Supply Ability:: 5000

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Product Details

Description

Features:

` XT Rectangular LED Performance
` 460 nm & 470 nm
` XR-18™ 18.0 mW min.
` XR-21™ 21.0 mW min.
` Thin 150 m Chip
` Low Forward Voltage 3.2 Typical at 20 mA
` Single Wire Bond Structure
` Class 2 ESD Rating
` Sn Contact for Low-Temp. Die Attach Methods
` Die Attach Options:
` Flux Eutectic; Flux & Temperature (-C)
` Eutectic; Temperature & Pressure (-D)

Application

Mobile Appliance LCD Backlighting
Digital Camera Flas

Specifications

DC Forward Current	30 mA
Peak Forward Current (1/10 duty cycle @ 1 kHz)	100 mA
LED Junction Temperature	125°C
Reverse Voltage	5 V
Operating Temperature Range	-40°C to +100°C
Storage Temperature Range	-40°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2	1000 V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2	Class 2

Notes:
This product is intended for use in a pre-molded surface mount package. It should be tested in the package and environment
consistent with the final use to validate applicability. CxxxXR230-Sxxxx-C and D are not intended for use where extended reliable
operation in high temperature and high humidity environments is required. For this condition or for use in a leaded radial lamp,
use CxxxXR230-Sxx00-A. See Cree XThin® Applications Note for more information.
Maximum ratings are package-dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die
but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1
3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing
temperature must not exceed 325°C (< 5 seconds). See Cree XThin Applications Note for more assembly process information.
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is
performed on each die. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an
integrating sphere using Illuminance E.
Caution: To avoid leakage currents and achieve maximum output efficiency, die attach material must not contact the side of the
chip. See Cree XThin Applications Note for more information.
Specifications are subject to change without notice.
XThin chips are shipped with the junction side down, not requiring a die transfer prior to die attach

Description

Cree's XT Rectangular LEDs CxxxXR230-Sxx00-x are the next generation of solid-state LEDs that combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low forward voltage. Cree's XT Rectangular chips CxxxXR230-Sxx00-x are tested for conformity to optical and electrical specifications and the ability to withstand 1000 V ESD. Applications for XT Rectangular LEDs include next-generation mobile appliances for use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption are required.

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