CxxxUT230-S0002

Features: ` Small Chip 230 x 230 x 85 m` UT LED Performance` 5.5 mW min. (455475 nm) Blue` 2.5 mW min. (500-510 nm) Traffic Green` 2.5 mW min. (520-535 nm) Green` Low Forward Voltage` 2.93.0 V Typical at 5 mA` Single Wire Bond Structure` Class 2 ESD RatingApplication· Mobile Phone Keypads· Audio ...

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SeekIC No. : 004319091 Detail

CxxxUT230-S0002: Features: ` Small Chip 230 x 230 x 85 m` UT LED Performance` 5.5 mW min. (455475 nm) Blue` 2.5 mW min. (500-510 nm) Traffic Green` 2.5 mW min. (520-535 nm) Green` Low Forward Voltage` 2.93.0 V Typi...

floor Price/Ceiling Price

Part Number:
CxxxUT230-S0002
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/22

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Product Details

Description



Features:

` Small Chip 230 x 230 x 85 m
` UT LED Performance
` 5.5 mW min. (455475 nm) Blue
` 2.5 mW min. (500-510 nm) Traffic Green
` 2.5 mW min. (520-535 nm) Green
` Low Forward Voltage
` 2.93.0 V Typical at 5 mA
` Single Wire Bond Structure
` Class 2 ESD Rating



Application

· Mobile Phone Keypads
· Audio Product Display Lighting
· Mobile Appliance Keypads
· Automotive Applications



Specifications

DC Forward Current 30 mA
Peak Forward Current (1/10 duty cycle @ 1 kHz) 100 mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -40°C to +100°C
Storage Temperature Range -40°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2 1000 V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2 Class 2



Description

Cree's UltraThin LEDs CxxxUT230-S0002 combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate to deliver uperior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and equire a low forward voltage. Cree's UT™ series chips are tested for conformity to optical and electrical specifications nd the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and hinner form factors are required.




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