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CxxxUT230-S0100

Features: ` Small Chip 230 x 230 x 85 m` Low Forward Voltage` 3.3V Typical at 20 mA` UT LED Performance` 8.0 mW min. (455475 nm) Blue` Single Wire Bond Structure` Class 2 ESD RatingApplication· Mobile Phone Keypads· White LEDs· Blue LEDs· Audio Product Display Lighting· Mobile Appliance KeypadsSp...

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SeekIC No. : 004319092 Detail

CxxxUT230-S0100: Features: ` Small Chip 230 x 230 x 85 m` Low Forward Voltage` 3.3V Typical at 20 mA` UT LED Performance` 8.0 mW min. (455475 nm) Blue` Single Wire Bond Structure` Class 2 ESD RatingApplication· Mob...

CxxxUT230-S0100 Data Sheet

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Part Number:
CxxxUT230-S0100
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/11

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Product Details

Description



Features:

` Small Chip 230 x 230 x 85 m
` Low Forward Voltage
` 3.3V Typical at 20 mA
` UT LED Performance
` 8.0 mW min. (455475 nm) Blue
` Single Wire Bond Structure
` Class 2 ESD Rating


Application

· Mobile Phone Keypads
· White LEDs
· Blue LEDs
· Audio Product Display Lighting
· Mobile Appliance Keypads


Specifications

DC Forward Current 30 mA
Peak Forward Current (1/10 duty cycle @ 1 kHz) 100 mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -40°C to +100°C
Storage Temperature Range -40°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2 1000 V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2 Class 2



Description

Cree's UltraThin LEDs CxxxUT230-S0100 combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate to deliver uperior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low orward voltage. Cree's UT™ series chips are tested for conformity to optical and electrical specifications and the bility to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner orm factors are required.




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