CPV364MF

Features: • Fully isolated printed circuit board mount package• Switching-loss rating includes all tail losses• HEXFREDTM soft ultrafast diodes• Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curveSpecifications Parameter...

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SeekIC No. : 004315886 Detail

CPV364MF: Features: • Fully isolated printed circuit board mount package• Switching-loss rating includes all tail losses• HEXFREDTM soft ultrafast diodes• Optimized for medium operat...

floor Price/Ceiling Price

Part Number:
CPV364MF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• Fully isolated printed circuit board mount package
• Switching-loss rating includes all "tail" losses
• HEXFREDTM soft ultrafast diodes
• Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curve



Specifications

  Parameter Max. Units
VCES Collector-to-Emitter Voltage 600 V
IC @ TC  = 25°C Continuous Collector Current each IGBT 27 A
IC @ TC = 100 Continuous Collector Currenteach IGBT 15 A
ICM Pulsed Collector Current 80 A
ILM Clamped Inductive Load Current 80 A
IF @ TC = 100 Diode Continuous Forward Current 9.3 A
IFM Diode Maximum Forward Current 80 A
VGE Gate-to-Emitter Voltage ±20 V
VISOL Isolation Voltage, any terminal to case, 1 min 2500 VRMS
PD @ TC = 25 Maximum Power Dissipation, each IGBT 63 W
PD @ TC = 100 Maximum Power Dissipation, each IGBT 25 W
TJ
TSTG
Operating Junction and
Storage Temperature Range
-40 to +150
  Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
  Mounting torque, 6-32 or M3 screw. 5-7 lbf?in ( 0.55-0.8 N?m)  



Description

The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. CPV364MF are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET.

This superior technology CPV364MF has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This package is highly suited to motor drive applications and where space is at a premium.




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