IGBT SIP MODULE 600V 31 IMS-2
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Processor Series : | SCF5249 | Series: | - |
Manufacturer: | Vishay Semiconductors | IGBT Type: | - |
Configuration: | Three Phase Inverter | Voltage - Collector Emitter Breakdown (Max): | 600V |
Vce(on) (Max) @ Vge, Ic: | 1.93V @ 15V, 3A | Current - Collector (Ic) (Max): | 5.7A |
Current - Collector Cutoff (Max): | 250µA | Input Capacitance (Cies) @ Vce: | 0.45nF @ 30V |
Power - Max: | 23W | Input: | Standard |
NTC Thermistor: | No | Mounting Type: | Through Hole |
Package / Case: | 19-SIP (13 Leads), IMS-2 |
• Short Circuit Rated UltraFast: Optimized for high operating frequencies >5.0 kHz , and Short Circuit Rated to 10s @ 125°C, VGE = 15V
• Fully isolated printed circuit board mount package
• Switching-loss rating includes all "tail" losses
• HEXFREDTM soft ultrafast diodes
• Optimized for high operating frequency (over 5kHz) See Fig. 1 for Current vs. Frequency curve
Parameter | Max. | Units | |
VCES |
Collector-to-Emitter Voltage | 600 | V |
IC @ TC = 25°C | Continuous Collector Current, each IGBT | 5.7 | A |
IC @ TC = 100°C |
Continuous Collector Current, each IGBT | 3.0 | |
ICM |
Pulsed Collector Current | 11 | |
ILM | Clamped Inductive Load Current | 11 | |
IF @ TC = 100°C |
Diode Continuous Forward Current | 3.4 | |
IFM | Diode Maximum Forward Current | 11 | |
tsc | Short Circuit Withstand Time | 10 | s |
VGE |
Gate-to-Emitter Voltage | ± 20 | V |
VISOL |
Isolation Voltage, any terminal to case, 1 minute | 2500 | VRMS |
PD @ TC = 25°C | Maximum Power Dissipation, each IGBT | 23 | W |
PD @ TC = 100°C | Maximum Power Dissipation, each IGBT | 9.1 | |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-40 to +150 | °C |
Soldering Temperature, for 10 sec. |
300 (0.063 in. (1.6mm) from case) | ||
Mounting torque, 6-32 or M3 screw | 5-7 lbf•in (0.55 - 0.8 N•m) |
The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. CPV362M4K are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET. This superior technology has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This
package is highly suited to motor drive applications and where space is at a premium.