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CPV363MF

Features: • Fully isolated printed circuit board mount package• Switching-loss rating includes all tail losses• HEXFREDTM soft ultrafast diodes• Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curveSpecifications Parameter...

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CPV363MF: Features: • Fully isolated printed circuit board mount package• Switching-loss rating includes all tail losses• HEXFREDTM soft ultrafast diodes• Optimized for medium operat...

CPV363MF Data Sheet

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Part Number:
CPV363MF
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Fully isolated printed circuit board mount package
• Switching-loss rating includes all "tail" losses
• HEXFREDTM soft ultrafast diodes
• Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curve


Specifications

  Parameter Max. Units
VCES Collector-to-Emitter Voltage 600 V
IC @ TC  = 25°C Continuous Collector Current each IGBT 16 A
IC @ TC = 100 Continuous Collector Currenteach IGBT 8.7 A
ICM Pulsed Collector Current 50 A
ILM Clamped Inductive Load Current 50 A
IF @ TC = 100 Diode Continuous Forward Current 6.1 A
IFM Diode Maximum Forward Current 50 A
VGE Gate-to-Emitter Voltage ±20 V
VISOL Isolation Voltage, any terminal to case, 1 min 2500 VRMS
PD @ TC = 25 Maximum Power Dissipation, each IGBT 36 W
PD @ TC = 100 Maximum Power Dissipation, each IGBT 14 W
TJ
TSTG		 Operating Junction and
Storage Temperature Range		 -40 to +150
  Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
  Mounting torque, 6-32 or M3 screw. 5-7 lbf?in ( 0.55-0.8 N?m)  



Description

The IGBT technology is the key to International Rectifier's advanced line ofIMS (Insulated Metal Substrate) Power Modules. CPV363MF are moreefficient than comparable bipolar transistor modules, while at the same timehaving the simpler gate-drive requirements of the familiar power MOSFET.This superior technology has now been coupled to a state of the art materialssystem that maximizes power throughput with low thermal resistance. Thispackage is highly suited to motor drive applications and where space is at apremium.




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