CHA5290

Features: ·Performances : 17.7 -24GHz·26dBm output power @ 1dB comp. gain·26 dB ± 1dB gain·DC power consumption, 400mA @ 6V·Chip size : 3.43 x 1.57 x 0.05 mmSpecifications Symbol Parameter Values Unit Vd Maximum drain bias voltage with Pin max=-2dBm 6.25 V Id Maximum drain bias c...

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SeekIC No. : 004313402 Detail

CHA5290: Features: ·Performances : 17.7 -24GHz·26dBm output power @ 1dB comp. gain·26 dB ± 1dB gain·DC power consumption, 400mA @ 6V·Chip size : 3.43 x 1.57 x 0.05 mmSpecifications Symbol Parameter Va...

floor Price/Ceiling Price

Part Number:
CHA5290
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·Performances : 17.7 -24GHz
·26dBm output power @ 1dB comp. gain
·26 dB ± 1dB gain
·DC power consumption, 400mA @ 6V
·Chip size : 3.43 x 1.57 x 0.05 mm



Specifications

Symbol Parameter Values Unit
Vd Maximum drain bias voltage with Pin max=-2dBm 6.25 V
Id Maximum drain bias current 625 mA
Vg Gate bias voltage -2.5 to +0.4 V
Ig Gate bias current -2.5 to +2.5 mA
Vgd Minimum negative gate drain voltage ( Vg - Vd) -8 V
Pin Maximum input power overdrive (2) 3 dBm
Tch Maximum channel temperature 175
Ta Operating temperature range -40 to +80
Tstg Storage temperature range -55 to +125



Description

The CHA5290 is a high gain four-stage monolithic medium power amplifier. It is designed for a wide range of applications, from military to commercial communication systems. The backside of the chip is both RF and DC grounds. This helps simplify the assembly process.

CHA5290 is manufactured with a PM-HEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography.

CHA5290 is available in chip form.


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