Features: ` Wide VCC low operation voltage : 1.65V ~ 3.6V` Ultra low power consumption : VCC = 3.6V Operation current : 10mA (Max.)at 55ns2mA (Max.)at 1MHz Standby current : 2.0uA (Typ.) at 3.0V/25 VCC = 1.2V Data retention current : 1.0uA at 25` High speed access time :-55 55ns (Max.) at VCC=1.65...
BH62UV4000: Features: ` Wide VCC low operation voltage : 1.65V ~ 3.6V` Ultra low power consumption : VCC = 3.6V Operation current : 10mA (Max.)at 55ns2mA (Max.)at 1MHz Standby current : 2.0uA (Typ.) at 3.0V/25 ...
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Features: *Wide VCC low operation voltage : 1.65V ~ 3.6V *Ultra low power consumption : VCC = 3.0...
Features: *Wide VCC low operation voltage : 1.65V ~ 3.6V *Ultra low power consumption : VCC = 3.0V...
Parameter |
Symbol |
Ratings |
Unit |
Terminal Voltage with Respect to GND |
VTERM |
-0.5(2) to 4.6V |
V |
Temperature Under Bias |
TBAIS |
-40 to +125 |
|
Storage Temperature |
TSTG |
-60 to +150 |
|
Power Dissipation |
PT |
1.0 |
W |
DC Output Current |
IOUT |
20 |
mA |
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. 2.0V in case of AC pulse width less than 30 ns
The BH62UV4000 is a high performance, ultra low power CMOS Static Random Access Memory organized as 524,288 by 8 bits and operates in a wide range of 1.65V to 3.6V supply voltage.Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical operating current of 1.5mA at 1MHz at 3.6V/25 and maximum access time of 55ns at 1.65V/85.
Easy memory expansion of BH62UV4000 is provided by an active LOW chip enable (CE) and active LOW output enable (OE) and three-state output drivers.
The BH62UV4000 has an automatic power down feature, reducing the power consumption significantly when chip is deselected.It is available in DICE form, JEDEC standard 32 pin 450mil Plastic SOP, 400mil TSOP-II, 600mil Plastic DIP, 8mmx13.4mm STSOP, 8mmx20mm TSOP and 36-ball BGA package.