Features: * Organization: 65,536 words × 32 or 36 bits
*NTD(TM)architecture for efficient bus operation
* Fast clock to data access: 7.5/8.0/10.0 ns
*Fast OE access time: 3.5/4.0 ns
* Fully synchronous operation
* Flow-through mode
* Asynchronous output enable control
* Available in 100-pin TQFP package
* Byte write enables
* Clock enable for operation hold
* Multiple chip enables for easy expansion
* 3.3V core power supply
* 2.5V or 3.3V I/O operation with separate VDDQ
* Self-timed write cycles
* Interleaved or linear burst modes
* Snooze mode for standby operationPinout
Specifications
| Parameter |
Symbol |
Min |
Max |
Unit |
| Power supply voltage relative to GND |
VDD , VDDQ |
0.5 |
+4.6 |
V |
| Input voltage relative to GND (input pins) |
VIN |
0.5 |
VDD + 0.5
|
V |
| Input voltage relative to GND (I/O pins) |
VIN |
0.5 |
VDDQ + 0.5
|
V |
| Power dissipation |
Pd |
- |
1.8 |
W |
| Short circuit output current |
IOUT |
- |
20 |
mA |
| Storage temperature |
Tstg |
65 |
+150 |
|
| Temperature under bias |
Tbias |
65 |
+135 |
|
Description The AS7C3364NTF32B/36B family is a high performance CMOS 2 Mbit synchronous Static Random Access Memory (SRAM) organized as 65,536 words × 32 or 36 bits and incorporates a LATE Write.
This variation of the 2Mb+ synchronous SRAM uses the No Turnaround Delay (NTD™) architecture, featuring an enhanced write operation that improves bandwidth over flowthrough burst devices. In a normal flowthrough burst device, the write data,command, and address are all applied to AS7C3364NTF32B on the same clock edge. If a read command follows this write command,the system must wait for one dead cycle for valid data to become available. AS7C3364NTF32B dead cycle can significantly reduce overall bandwidth for applications requiring random access or read-modify-write operations.
NTD™ AS7C3364NTF32B devices use the memory bus more efficiently by introducing a write latency which matches the one-cycle flow-through read latency. Write data is applied one cycle after the write command and address, allowing the read pipeline to clear.With NTD™, write and read operations of AS7C3364NTF32B can be used in any order without producing dead bus cycles.
Assert R/W low to perform write cycles. Byte write enable controls write access to specific bytes, or AS7C3364NTF32B can be tied low for full 36 bit writes. Write enable signals, along with the write address, are registered on a rising edge of the clock. Write data is applied to the device one clock cycle later. Unlike some asynchronous SRAMs, output enable OE does not need to be toggled for write operations; it can be tied low for normal operations. Outputs of AS7C3364NTF32B go to a high impedance state when the device is de-selected by any of the three chip enable inputs.
Use the ADV (burst advance) input to perform burst read, write and deselect operations. When ADV is high, external addresses, chip select, R/W pins are ignored, and internal address counters increment in the count sequence specified by the LBO control. Any device operations, including burst, can be stalled using the CEN=1, the clock enable input.
The AS7C3364NTF32B/36B operates with a 3.3V ± 5% power supply for the device core (VDD). DQ circuits use a separate power supply (VDDQ) that operates across 2.5V or 3.3V ranges. These devices are available in a 100-pin TQFP package.
AS7C3364NTF32B Data Sheet
