Features: `21 dBm Output Power @ 18 GHz`High Associated Gain, 9 dB @ 18 GHz`High Power Added Efficiency, 25%`Broadband Operation, DC40 GHz`0.25 µm Ti/Pd/Au Gates`Passivated Surface`Through-Substrate Via Hole GroundingSpecifications Characteristic Value Drain to Source Voltage (VDS...
AFM04P2-000: Features: `21 dBm Output Power @ 18 GHz`High Associated Gain, 9 dB @ 18 GHz`High Power Added Efficiency, 25%`Broadband Operation, DC40 GHz`0.25 µm Ti/Pd/Au Gates`Passivated Surface`Through-Sub...
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Features: `21 dBm Output Power @ 18 GHz`High Associated Gain, 9 dB @ 18 GHz`High Power Added Effic...
Features: `24 dBm Output Power @ 18 GHz`High Associated Gain, 8.5 dB @ 18 GHz`High Power Added Eff...
Features: `22 dBm Output Power @ 18 GHz`High Associated Gain, 9 dB @ 18 GHz`High Power Added Effic...
Characteristic |
Value |
Drain to Source Voltage (VDS) |
6 V |
Gate to Source Voltage (VGS) |
-4 V |
Drain Current (IDS) |
IDSS |
Gate Current (IGS) |
1 mA |
Total Power Dissipation (PT) |
700mW |
Storage Temperature (TST) |
-65 to +150°C |
Channel Temperature (TCH) |
175°C |
The AFM04P2-000 is a high performance power GaAs MESFET chip having a gate length of 0.25 µm and a total gate periphery of 400 µm. The device has excellent gain and power performance through 40 GHz, making AFM04P2-000 suitable for a wide range of commercial and military applications in oscillator and amplifier circuits. It employs Ti/Pd/Au gate metallization and surface passivation to ensure a rugged, reliable part. Throughsubstrate via holes are incorporated into the chip to facilitate low inductance grounding of the source for improved high frequency and high gain performance.