Features: ·4 -C 128K x 8 SRAMs & 4-C 512K x 8 Flash Die in One MCM ·Access Times of 25ns, 35ns (SRAM) and60ns, 70ns, 90ns (Flash) ·Organized as 128K x 32 of SRAM and 512K x 32 ·of Flash Memory with Common Data Bus ·Low Power CMOS ·Input and Output TTL Compatible Design ·MIL-PRF-38534 Compliant...
ACT-SF41632N-26P1I: Features: ·4 -C 128K x 8 SRAMs & 4-C 512K x 8 Flash Die in One MCM ·Access Times of 25ns, 35ns (SRAM) and60ns, 70ns, 90ns (Flash) ·Organized as 128K x 32 of SRAM and 512K x 32 ·of Flash Memory w...
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Features: 6 Low Power Micron 1M X 16 Synchronous Dynamic Random Access Memory Chips in one MCMUser...
Features: ` 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package` Overall Configuration is ...
Symbol | Rating | Range | Units |
TC |
Case Operating Temperature | -55 to +125 | |
TSTG |
Storage Temperature | -65 to +150 | |
VG |
Maximum Signal Voltage to Ground | -0.5 to +7 | V |
TL |
Maximum Lead Temperature (10 seconds) | 300 | |
Parameter | |||
Flash Data Retention | 10 Years | ||
Flash Endurance (Write/Erase Cycles) | 10,000 |