Features: . 4 128K x 8 SRAMs & 4 128K x 8 Flash Die in One MCM. Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70ns or 90ns (Flash). Organized as 128K x 32 of SRAM and 128K x 32 of Flash Memory with Common Data Bus. Low Power CMOS. Input and Output TTL Compatible Design. MIL...
ACT-SF128K32: Features: . 4 128K x 8 SRAMs & 4 128K x 8 Flash Die in One MCM. Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70ns or 90ns (Flash). Organized as 128K x 32 of SRAM and 128K x ...
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Features: 6 Low Power Micron 1M X 16 Synchronous Dynamic Random Access Memory Chips in one MCMUser...
Features: ` 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package` Overall Configuration is ...
. 4 128K x 8 SRAMs & 4 128K x 8 Flash Die in One MCM
. Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70ns or 90ns (Flash)
. Organized as 128K x 32 of SRAM and 128K x 32 of Flash Memory with Common Data Bus
. Low Power CMOS
. Input and Output TTL Compatible Design
. MIL-PRF-38534 Compliant MCMs Available
. Decoupling Capacitors and Multiple Grounds for Low Noise
. Commercial, Industrial and Military Temperature Ranges
. Industry Standard Pinouts
. TTL Compatible Inputs and Outputs
. Packaging Hermetic Ceramic
66Lead, PGA-Type, 1.385"SQ x 0.245"max,
Aeroflex code# P3,P7 without/with shoulders
FLASH MEMORY FEATURES
. Sector Architecture (Each Die)
8 Equal Sectors of 16K bytes each
Any combination of sectors can be erased with
one command sequence.
. +5V Programing, +5V Supply
. Embedded Erase and Program Algorithms
. Hardware and Software Write Protection
. Page Program Operation and Internal
Program Control Time.
. 10,000 Erase/Program Cycles
Symbol |
Rating |
Range |
Units |
TC |
Operating Temperature |
-55 to +125 |
°C |
TSTG |
Storage Temperature |
-65 to +150 |
°C |
VG |
Maximum Signal Voltage to Ground |
-0.5 to +7 |
V |
TL |
Maximum Lead Temperature (10 seconds) |
300 |
°C |