3D7503

Features:

·  All-silicon, low-power CMOS technology
·  Encoder and decoder function independently
·  Encoder has buffered clock output
·  TTL/CMOS compatible inputs and outputs
·  Vapor phase, IR and wave solderable
·  Auto-insertable (DIP pkg.)
·  Low ground bounce noise
·  Maximum data rate: 50 MBaud
·  Data rate range: ±15%
·  Lock-in time: 1 bit


Pinout

PIN DESCRIPTIONS
Encoder:
CIN         Clock Input
DIN         Data Input
RESB       Reset
CEN        Clock buffer enable
TXENB     Transmit enable
CBUF      Buffered clock
TX,TXB    Transmitted signal
Decoder:
RX          Received Signal
COUT     Recovered Clock
DOUTB   Recovered Data
Common:
LOOP     Loop enable
VDD       +5 Volts
GND      Ground

Specifications

PARAMETER	SYMBOL	MIN	MAX	UNITS	NOTES
DC Supply Voltage	VDD	-0.3	7.0	V
Input Pin Voltage	VIN	-0.3	VDD+0.3	V
Input Pin Current	IIN	-1.0	1.0	mA	25C
Storage Temperature	TSTRG	-55	150	C	10 sec
Lead Temperature	TLEAD		300	C

Description

The 3D7503 is a monolithic CMOS Manchester Encoder/Decoder combo chip. The 3D7503 uses bi-phase-level encoding to embed a clock signal into a data stream for transmission across a communications link. In this encoding mode, a logic one is represented by a high-to-low transition in the center of the bit cell, while a logic zero is represented by a low-to-high transition.

The Manchester encoder combines the clock (CIN) and data (DIN) into a single bi-phase-level signal (TX). An inverted version of this signal (TXB) is also available. The data baud rate (in MBaud) is equal to the input clock frequency (in MHz). A replica of the clock input is also available (CBUF).