X23D23PHIL, X24001, X2400P Selling Leads, Datasheet
MFG:ST Package Cooled:SSOP D/C:98+
X23D23PHIL, X24001, X2400P Datasheet download
Part Number: X23D23PHIL
MFG: ST
Package Cooled: SSOP
D/C: 98+
MFG:ST Package Cooled:SSOP D/C:98+
X23D23PHIL, X24001, X2400P Datasheet download
MFG: ST
Package Cooled: SSOP
D/C: 98+
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Datasheet: X231
File Size: 68973 KB
Manufacturer: ETC [ETC]
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PDF/DataSheet Download
Datasheet: X24001
File Size: 48457 KB
Manufacturer: XICOR [Xicor Inc.]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: X24001
File Size: 48457 KB
Manufacturer: XICOR [Xicor Inc.]
Download : Click here to Download
The X24001 is a CMOS 128 bit serial E2PROM, internally organized as 16 x 8. The X24001 features a serial interface and software protocol allowing operation on a simple two wire bus.
The X24001 is ideally suited for identification applications such as serial numbers or device revision numbers which need to be stored and retrieved electronically.
VPGM is used to enable writes to the device. This provides full protection of the data in the user's environment where VPGM is not available.
Xicor E2PROMs are designed and tested for applications requiring extended endurance. Inherent data retention is greater than 100 years.
The X24001 is fabricated with Xicor's Advanced CMOS Floating Gate technology.
Temperature under Bias
X24001 ......................................... 65°C to +135°C
Storage Temperature .......................... 65°C to +150°C
Voltage on any Pin with
Respect to VSS ............................................ 1V to +7V
Voltage on SCL with
Respect to VSS .......................................... 1V to +17V
D.C. Output Current .....................................................5mA
Lead Temperature
(Soldering, 10 seconds) .............................. 300°C
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.