W836290, W83629D, W83629G Selling Leads, Datasheet
MFG:3266 Package Cooled:QFP D/C:04+
W836290, W83629D, W83629G Datasheet download
Part Number: W836290
MFG: 3266
Package Cooled: QFP
D/C: 04+
MFG:3266 Package Cooled:QFP D/C:04+
W836290, W83629D, W83629G Datasheet download
MFG: 3266
Package Cooled: QFP
D/C: 04+
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PDF/DataSheet Download
Datasheet: W83176G-732
File Size: 411857 KB
Manufacturer: WINBOND [Winbond]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: W83629D
File Size: 278029 KB
Manufacturer: WINBOND [Winbond]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: W83176G-732
File Size: 411857 KB
Manufacturer: WINBOND [Winbond]
Download : Click here to Download
W83628F is a PCI-to-ISA bus conversion IC. W83629D is a condensed centralizer IC for IRQ and DMA control. W83628F and W83629D together form a complete set for the PCI-to-ISA bridge.
For the new generation Intel chipset Camino and Whitney, featuring LPC bus, there is no support for ISA bus and slots. However the demand of ISA devices still exist. For such case, W83628F plus W83629D are the best companion solution for the non-ISA chipset. Also the packages of W83628F (128-QFP) and W83629D (48- LQFP) had been chosen to be the most economic solution for save the M/B board layout size and cost.
For the new generation chipset featuring LPC interface and support no ISA bus, W83627HF/F (Winbond LPC I/O) together with the set of W83628F and W83629D is the complete solution.