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VKI50-12P1, VKI75-06P1, VKM40-06P1

VKI50-12P1, VKI75-06P1, VKM40-06P1 Selling Leads, Datasheet

MFG:IXYS  Category:Discrete Semiconductor Products  Package Cooled:TO-200AB  D/C:2008

VKI50-12P1, VKI75-06P1, VKM40-06P1 Picture

VKI50-12P1, VKI75-06P1, VKM40-06P1 Datasheet download

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Part Number: VKI50-12P1

Category: Discrete Semiconductor Products

MFG: IXYS

Package Cooled: TO-200AB

D/C: 2008

Description: MOSFET H-BRIDGE 600V ECO-PAC2

 

 
 
 
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About VKI50-06P1

PDF/DataSheet Download

Datasheet: VKI50-06P1

File Size: 114590 KB

Manufacturer: IXYS [IXYS Corporation]

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VKI75-06P1 Suppliers

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About VKI50-06P1

PDF/DataSheet Download

Datasheet: VKI50-06P1

File Size: 114590 KB

Manufacturer: IXYS [IXYS Corporation]

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VKM40-06P1 Suppliers

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About VKM40-06P1

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Datasheet: VKM40-06P1

File Size: 61503 KB

Manufacturer: IXYS [IXYS Corporation]

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VKM40-06P1 Parameters

Technical/Catalog InformationVKM40-06P1
VendorIXYS
CategoryDiscrete Semiconductor Products
Mounting TypeChassis Mount
FET Polarity4 N-Channel (H-Bridge)
Drain to Source Voltage (Vdss)600V
Current - Continuous Drain (Id) @ 25° C38A
Rds On (Max) @ Id, Vgs70 mOhm @ 25A, 10V
Input Capacitance (Ciss) @ Vds -
Power - Max-
PackagingBulk
Gate Charge (Qg) @ Vgs220nC @ 10V
Package / CaseECO-PAC2
FET Feature*
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names VKM40 06P1
VKM4006P1

VKM40-06P1 Features

ECO-PAC 2 with DCB Base
- Electrical isolation towards the heatsink
- Low coupling capacitance to the heatsink for reduced EMI
- High power dissipation
- High temperature cycling capability of chip on DCB
- solderable pins for DCB mounting
fast CoolMOS power MOSFET
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped inductive switching (UIS)
- Low thermal resistance due to reduced chip thickness
Enhanced total power density

VKM40-06P1 Typical Application

Switched mode power supplies (SMPS)
Uninterruptible power supplies (UPS)
Power factor correction (PFC)
Welding
Inductive heating

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