UFR300, UFR301, UFR302 Selling Leads, Datasheet
MFG:PHY Package Cooled:DO-201AD
UFR300, UFR301, UFR302 Datasheet download
Part Number: UFR300
MFG: PHY
Package Cooled: DO-201AD
D/C:
UFR300, UFR301, UFR302
- Table of contents:
Info of UFR300
Info of UFR301
Info of UFR302
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About UFR10010
PDF/DataSheet Download
Datasheet: UFR10010
File Size: 128892 KB
Manufacturer:
Download : Click here to Download
About UFR3010
PDF/DataSheet Download
Datasheet: UFR3010
File Size: 211813 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
About UFR3020
PDF/DataSheet Download
Datasheet: UFR3020
File Size: 211813 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
UFR300 Maximum Ratings
| SYMBOL | UFR 300 |
UFR 301 |
UFR 302 |
UFR 303 |
UFR 304 |
UFR 305 |
UFR 306 |
UFR 308 |
UFR 310 |
UNIT | |
| Maximum Recurrent Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 300 | 400 | 500 | 600 | 800 | 1000 | V |
| Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 210 | 280 | 350 | 420 | 560 | 700 | V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 300 | 400 | 500 | 600 | 800 | 1000 | V |
| Maximum Average Forward Rectified Current TC=50 |
IO | 3 | A | ||||||||
| Peak Forward Surge Current, 8.3ms singleHalf sine-wave superimposed on rated load | IFSM | 160 | A | ||||||||
| Maximum Forward Voltage at3 Amps DC | VFM | 1.25 | 1.7 | V | |||||||
| Maximum DC Reverse Current @TC=25 At Rated DC Blocking Voltage @TC=125 |
IRM | 5 50 |
uA | ||||||||
| Maximum Reverse Recovery Time (If=0.5A,IR=1A,IRR=0.25A) | Trr | 50 | 75 | nS | |||||||
| Typical junction Capacitance (Note 1) | CJ | 45 | pF | ||||||||
| Typical Thermal Resistance ,Junction to Lead | RJC | 20 | /W | ||||||||
| Operating Junction and Storage Temperature Range |
TJ, TSTG | -65 to + 150 | |||||||||
UFR300 Features
·PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ··Typical < 2%, Max. < 10% of Die Area)
·LOW SWITCHING NOISE
·LOW THERMAL RESISTANCE
·HIGH SWITCHING CAPABILITY
·LOW FORWARD VOLTAGE DROP
·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ··Typical < 2%, Max. < 10% of Die Area)
·LOW SWITCHING NOISE
·LOW THERMAL RESISTANCE
·HIGH SWITCHING CAPABILITY
·LOW FORWARD VOLTAGE DROP
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