TPCP8503, TPCP8602, TPCP8604 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:8 D/C:07NOPB
TPCP8503, TPCP8602, TPCP8604 Datasheet download
Part Number: TPCP8503
MFG: TOSHIBA
Package Cooled: 8
D/C: 07NOPB
MFG:TOSHIBA Package Cooled:8 D/C:07NOPB
TPCP8503, TPCP8602, TPCP8604 Datasheet download
MFG: TOSHIBA
Package Cooled: 8
D/C: 07NOPB
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PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
Parameter | Symbol | Ratings | Unit | |
Collector-Base Voltage | VCBO | -50 | V | |
Collector-Emitter Voltage | VCEO | -50 | V | |
Emitter-Base Voltage | VEBO | -7 | V | |
Collector current | DC (Note 1) | IC | -2.5 | mA |
Pulse (Note 1 ) | ICP | -4.0 | mA | |
Base Current | IB | -0.25 | mA | |
Collector power dissipation (t = 10s) |
t = 10s | PC (Note 2) | 3.0 | W |
DC | 1.25 | |||
Junction Temperature | TJ | 150 | ||
Storage Temperature | TSTG | -55 ~ +150 |
Note 1: Ensure that the junction temperature does not exceed 150°C during use of this device.
Note 2: Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).