TC255P, TC2571, TC2574VPA Selling Leads, Datasheet
MFG:TI Package Cooled:DIP D/C:05+
TC255P, TC2571, TC2574VPA Datasheet download
Part Number: TC255P
MFG: TI
Package Cooled: DIP
D/C: 05+
MFG:TI Package Cooled:DIP D/C:05+
TC255P, TC2571, TC2574VPA Datasheet download
MFG: TI
Package Cooled: DIP
D/C: 05+
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PDF/DataSheet Download
Datasheet: TC255P
File Size: 245850 KB
Manufacturer: TI [Texas Instruments]
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PDF/DataSheet Download
Datasheet: TC2571
File Size: 155494 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TC2001
File Size: 679172 KB
Manufacturer:
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The TC2571 is packaged the TC1501 Pseudomorphic High Electron Mobility Transistor (PHEMT) GaAs Power chip. The cu-based ceramic package that requires a surface-mount package is a low-cost and high performance package. All devices are 100% DC tested to assure consistent quality. Typical applications include high dynamic range power amplifier for commercial applications including Cellular/PCS systems, and military high performance power amplifier.
Symbol |
Parameter |
Rating |
VDS |
Drain-Source Voltage |
12 V |
VGS |
Gate-Source Voltage |
-5 V |
IDS |
Drain Current |
IDSS |
Pin |
RF Input Power, CW |
26 dBm |
PT |
Continuous Dissipation |
3.8 W |
TCH |
Channel Temperature |
175 |
TSTG |
Storage Temperature |
- 65 to +175 |