SFU9210, SFU9220, SFU9230B Selling Leads, Datasheet
MFG:FAIRC Package Cooled:TO-251 D/C:08+
SFU9210, SFU9220, SFU9230B Datasheet download
Part Number: SFU9210
MFG: FAIRC
Package Cooled: TO-251
D/C: 08+
MFG:FAIRC Package Cooled:TO-251 D/C:08+
SFU9210, SFU9220, SFU9230B Datasheet download
MFG: FAIRC
Package Cooled: TO-251
D/C: 08+
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PDF/DataSheet Download
Datasheet: SFU9210
File Size: 262608 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SFU9220
File Size: 263646 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SFU9230B
File Size: 644009 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
Symbol |
Characteristic |
Value |
Units |
VDSS |
Drain-to-Source Voltage |
-200 |
V |
ID |
Continuous Drain Current (TC=25) |
-1.6 |
A |
Continuous Drain Current (TC=100) |
-1.08 | ||
IDM |
Drain Current-Pulsed |
-6.4 |
A |
VGS |
Gate-to-Source Voltage |
±30 |
V |
EAS |
Single Pulsed Avalanche Energy |
119 |
mJ |
IAR |
Avalanche Current |
-1.6 |
A |
EAR |
Repetitive Avalanche Energy |
5.2 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt |
-6.5 |
V/ns |
PD |
Total Power Dissipation (TA=25)* |
2.5
|
W |
Total Power Dissipation (TC=25) Linear Derating Factor |
52 0.42 |
W W/°C | |
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
°C |
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |
Symbol |
Characteristic |
Value |
Units |
VDSS |
Drain-to-Source Voltage |
-200 |
V |
ID |
Continuous Drain Current (TC=25) |
-3.1 |
A |
Continuous Drain Current (TC=100) |
-1.96 | ||
IDM |
Drain Current-Pulsed |
-12 |
A |
VGS |
Gate-to-Source Voltage |
±30 |
V |
EAS |
Single Pulsed Avalanche Energy |
256 |
mJ |
IAR |
Avalanche Current |
-3.1 |
A |
EAR |
Repetitive Avalanche Energy |
3.0 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt |
-5.0 |
V/ns |
PD |
Total Power Dissipation (TA=25)* |
2.5
|
W |
Total Power Dissipation (TC=25) Linear Derating Factor |
30 0.24 |
W W/°C | |
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
°C |
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |
Symbol |
Parameter |
SFR9230B / SFU9230B |
Units |
VDSS |
Drain-Source Voltage |
-200 |
V |
ID |
Drain Current - Continuous (TC=25) |
-5.4 |
A |
-3.4 |
A | ||
IDM |
Drain Current - Pulsed (Note 1) |
-22 |
A |
VGS |
Gate-Source Voltage |
±30 |
V |
EAS |
Single Pulsed Avalanche Energy (Note 2) |
390 |
mJ |
IAR |
Avalanche Current (Note 1) |
-5.4 |
A |
EAR |
Repetitive Avalanche Energy (Note 1) |
4.9 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt (Note 3) |
-5.5 |
V/ns |
PD |
Power Dissipation (TA=25) * |
2.5 |
W |
Power Dissipation (TC=25) - Derate above 25°C |
49 |
W | |
0.39 |
W/°C | ||
TJ,TSTG |
Operating and Storage Temperature Range |
-55 to +150 |
°C |
TL |
Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds |
300 |
°C |