S530-A2, S530DD076227, S530-E1 Selling Leads, Datasheet
Package Cooled:SOP D/C:+
S530-A2, S530DD076227, S530-E1 Datasheet download
Part Number: S530-A2
MFG: --
Package Cooled: SOP
D/C: +
Package Cooled:SOP D/C:+
S530-A2, S530DD076227, S530-E1 Datasheet download
MFG: --
Package Cooled: SOP
D/C: +
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PDF/DataSheet Download
Datasheet: S530-A2
File Size: 221488 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: S530-A2
File Size: 221488 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: S530-A2
File Size: 221488 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
The 25-21 SMD Taping is much smaller than leaded components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes them ideal for miniature application, etc
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
Vr |
5 |
V |
Forward Current |
If |
25 |
mA |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +90 |
|
Soldering Temperature |
Tsol |
260 (for 5 second) |
|
Electrostatic Discharge |
ESD |
2000 |
V |
Power Dissipation |
Pd |
60 |
mW |
Peak Forward Current(Duty 1/10 @ 1KHZ) |
If(Peak) |
160 |
mA |