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RFV10N50, RFV10N50BE, RFW2N06RLE

RFV10N50, RFV10N50BE, RFW2N06RLE Selling Leads, Datasheet

MFG:Intersil  Package Cooled:7850  D/C:08+/09+

RFV10N50, RFV10N50BE, RFW2N06RLE Picture

RFV10N50, RFV10N50BE, RFW2N06RLE Datasheet download

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Part Number: RFV10N50

 

MFG: Intersil

Package Cooled: 7850

D/C: 08+/09+

 

 

 
 
 
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About RFV10N50

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Datasheet: RFV10N50

File Size: 67959 KB

Manufacturer: INTERSIL [Intersil Corporation]

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Datasheet: RFV10N50BE

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Manufacturer: INTERSIL [Intersil Corporation]

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Datasheet: RFW2N06RLE

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RFV10N50BE General Description

The RFV10N50BE is an N-Channel fast switching MOSFET transistor that is designed for switching regulators, inverters and motor drivers. The RFV10N50BE is a monolithic structure incorporating a high voltage, high current MOSFET, a control MOSFET and ESD protection diodes. As indicated in the symbol to the right, the turn-on of the main MOSFET is controlled by Gate 1 (G1). The control MOSFET, controlled by Gate 2 (G2), is distributed throughout the structure. Gate 2 provides a very low impedance and inductive path to rapidly discharge the gate of the main MOSFET. Gate 2 affords very fast turn-off (typically less than 25ns) when desired. A separate return connection, Source Kelvin (SK), is supplied for the gate drive circuit to avoid voltage induced transients from the output circuit during switching. The  RFV10N50BE can be operated directly from integrated circuits.

RFV10N50BE Maximum Ratings

Drain Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS    500         V
Gate Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS +14, -0.3 V
Control FET Gate Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS +14, -0.3 V
Electrostatic Discharge Rating, MIL-STD-883, Category B(2) . . . . . . . . . . . . . . . . . . . . . . . . . . ESD 2 KV
Drain Current
RMS Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID 10 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 25 A
Single Pulse Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS Refer to UIS Curve
Control FET Avalanche Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IAS 1.5 A
Control FET Single Pulse Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS 50 mJ
Power Dissipation
TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 156 W
Derate Above +25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.25 W/o C
Control FET Power Dissipation
TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 21 W
Derate Above +25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.17 W/o C
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSTG, TJ -55 to +150 o C

RFV10N50BE Features

• 10A, 500V
• rDS(ON) = 0.480W
• Very Fast Turn-Off Characteristics
• Nanosecond Switching Speeds
• Electrostatic Discharge Protected
• UIS Rating Curve
• SOA is Power Dissipation Limited
• High Input Impedance

RFW2N06RLE Maximum Ratings

  RFW2N06RLE
UNITS
Drain to Source Breakdown Voltage (Note 1) . . . . VDS
Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . .VDGR
Continuous Drain Current . . . . . . . . . . . .ID
Pulsed Drain Current (Note 3) . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . VGS
Maximum Power Dissipation (Figure 1). . . . . . . . . PD
Linear Derating Factor (Figure 1. . . . . . . .
Single Pulse Avalanche Energy Rating . . . . . . . EAS
Electrostatic Discharge Rating, MIL-STD-883, Catagory B(2) .ESD
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . .Tpkg
60
60
2
14
-5 to 10
1.09
0.009
Refer to UIS Curve
2
-55 to 150
300
260
V
V
A
A
V
W
W/o C
KV
o C
o C
o C

RFW2N06RLE Features

• 2A, 60V
• rDS(on) = 0.160W
• UIS Rating Curve (Single Pulse)
• Design Optimized For 5 Volt Gate Drive
• Can be Driven Directly from CMOS, NMOS, TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Electrostatic Discharge Protected
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

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