PGH5016AM, PGH508, PGH508A Selling Leads, Datasheet
MFG:NIEC Package Cooled:50A/1600V D/C:07+
PGH5016AM, PGH508, PGH508A Datasheet download
Part Number: PGH5016AM
MFG: NIEC
Package Cooled: 50A/1600V
D/C: 07+
MFG:NIEC Package Cooled:50A/1600V D/C:07+
PGH5016AM, PGH508, PGH508A Datasheet download
MFG: NIEC
Package Cooled: 50A/1600V
D/C: 07+
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Datasheet: PGH5016AM
File Size: 232395 KB
Manufacturer: NIEC [Nihon Inter Electronics Corporation]
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PDF/DataSheet Download
Datasheet: PGH508AM
File Size: 240388 KB
Manufacturer: NIEC [Nihon Inter Electronics Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: PGH508AM
File Size: 240388 KB
Manufacturer: NIEC [Nihon Inter Electronics Corporation]
Download : Click here to Download
The PGH508A has the following features including (1)The output voltage is equal to supply voltage. (As for Nch open drain type, equal to pull-up voltage.) ;(2)When the supply voltage is down to the detector threshold voltage level(Point A), VrefVDD(Rb+Rc)/(Ra+Rb+Rc) is true, then output of the comparator is reversed from L to H, therefore the output voltage becomes GND level;(3)When the supply voltage is lower than minimum operating voltage, the operation of output transistor is indefinite. In the case of Nch open drain type, the output voltage is equal to pull-up voltage.;(4)The output voltage becomes GND level.;(5)When the supply voltage is higher than released voltage (Point B), VrefVDDRb/(Ra+Rb) is true, then the output of the comparator reaches the threshold level, and the output of Shmitt trigger is reversed from H to L, then the output voltage is equal to the supply voltage.
Receiver direct memory access (DMA) signaling is also available through this output. One of two types of DMA signaling can be selected using FCR3 when in FIFO mode. Only DMA mode 0 is allowed when in TL16C450 mode. For signal transfer DMA (a transfer is made between CPU bus cycles), mode 0 is used. Multiple transfers that are made continuously until the receiver FIFO has been emptied are supported by mode 1.These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite).