PAL16R4AM, PAL16R4AMFKB, PAL16R4AMJ-883B Selling Leads, Datasheet
MFG:MM Package Cooled:DIP-20P D/C:07+
PAL16R4AM, PAL16R4AMFKB, PAL16R4AMJ-883B Datasheet download
Part Number: PAL16R4AM
MFG: MM
Package Cooled: DIP-20P
D/C: 07+
MFG:MM Package Cooled:DIP-20P D/C:07+
PAL16R4AM, PAL16R4AMFKB, PAL16R4AMJ-883B Datasheet download
MFG: MM
Package Cooled: DIP-20P
D/C: 07+
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Datasheet: PAL16R4AM
File Size: 155349 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: PAL16R4AMFKB
File Size: 751840 KB
Manufacturer: TI [Texas Instruments]
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PDF/DataSheet Download
Datasheet: PAL10C1CJ
File Size: 431071 KB
Manufacturer: ETC [ETC]
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These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will
provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of !custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.
The PAL16' M series is characterized fo operation over the full military temperature range of -55 to 125.