NDM3001, NDM60-48S05T2/W, NDM6060-030E Selling Leads, Datasheet
MFG:97+ Package Cooled:SOP-16 D/C:09+
NDM3001, NDM60-48S05T2/W, NDM6060-030E Datasheet download
Part Number: NDM3001
MFG: 97+
Package Cooled: SOP-16
D/C: 09+
NDM3001, NDM60-48S05T2/W, NDM6060-030E
- Table of contents:
Info of NDM3001
Info of NDM60-48S05T2/W
Info of NDM6060-030E
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About NDM3001
PDF/DataSheet Download
Datasheet: NDM3001
File Size: 256990 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About NDM3000
PDF/DataSheet Download
Datasheet: NDM3000
File Size: 252582 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About NDM3000
PDF/DataSheet Download
Datasheet: NDM3000
File Size: 252582 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
NDM3001 General Description
The NDM3001 three phase brushless motor driver consists of three N-Channel and P-Channel MOSFETs in a half bridge configuration. These devices are produced using Fairchild's proprietary, high cell density DMOS technology. This very high density process is tailored to minimize on-state resistance which reduces power loss, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage 3 phase motor driver such as disk drive spindle motor control and other half bridge applications.
NDM3001 Maximum Ratings
|
Symbol |
Parameter |
NDM3000 |
Units | |
|
VDSS VGSS |
Drain-Source Voltage (All Types) Gate-Source Voltage (All Types) |
±30 ±20 ±2.9 ±10 2.5 1.6 1.4 -55 to 150 |
V V A W °C | |
|
ID |
Drain Current Q1+Q4 or Q1+Q6 or Q3+Q2 - Continuous Q3+Q6 or Q5+Q2 or Q5+Q4 Pulsed |
(Note 1a & 2) | ||
|
PD |
Total Power Dissipation Q1+Q4 or Q1+Q6 or Q3+Q2 or Q3+Q6 or Q5+Q2 or Q5+Q4 |
(Note 1a) (Note 1b) (Note 1c) | ||
| TJ,TSTG | Operating and Storage Temperature Range | |||
NDM3001 Features
· ±2.9 A, ±30 V, 2.5W
· High density cell design for extremely low RDS(ON).
· High power and current handling capability.
· Industry standard SOIC-16 surface mount package.
· High density cell design for extremely low RDS(ON).
· High power and current handling capability.
· Industry standard SOIC-16 surface mount package.
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