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VDD, DIN, CS, DCLK to GND ....................................-0.3V to +6V Digital Outputs to GND...............................-0.3V to (VDD + 0.3V) VREF, X+, X-, Y+, Y-, IN3, IN4 to GND.........-0.3V to (VDD + 0.3V) Maximum Current into Any Pin .......................................±50mA Maximum ESD per IEC-61000-4-2 (per MIL STD-883 HBM) X+, X-, Y+, Y-, IN3, IN4 .............................................15kV (4kV) All Other Pins ...........................................................2kV (500V) Continuous Power Dissipation (TA = +70) 16-Pin QSOP (derate 8.30mW/ above +70).............667mW 16-Pin TSSOP (derate 5.70mW/ above +70) ...........456mW Operating Temperature Range ...........................-40 to +85 Junction Temperature.....................................................+150 Storage Temperature Range ............................-65 to +150 Lead Temperature (soldering, 10s) ................................+300 Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.