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MPX4250D, MPX5004G, MPX5010DP/MPX5010D

Table of contents:
Info of MPX4250D
Info of MPX5004G
Info of MPX5010DP/MPX5010D

MPX4250D, MPX5004G, MPX5010DP/MPX5010D Selling Leads, Datasheet

MFG:Freescale Semiconductor Category:Sensors, Transducers D/C:912

MPX4250D, MPX5004G, MPX5010DP/MPX5010D Datasheet download

Five Points

Part Number: MPX4250D

Category: Sensors, Transducers

MFG: Freescale Semiconductor

Package Cooled:

D/C: 912

Description: SENSOR DIFF PRESS 36.3PSI MAX

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MPX4250D Parameters

Technical/Catalog Information	MPX4250D
Vendor	Freescale Semiconductor
Category	Sensors, Transducers
Operating Pressure	2.9 ~ 36.3 PSI
Voltage - Rated	5VDC
Output	0.2 ~ 4.9V
Package / Case	6-SIP
Pressure Type	Differential
Features	Ratiometric Output
Interface	PC Board Mount
Pressure Port	Open
Port Size	*
Termination Style	*
Voltage - Supply	*
Operating Temperature	*
Drawing Number	375; 867-08; ; 6
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	MPX4250D MPX4250D

MPX4250D General Description

The MPX4250D series piezoresistive transducer is a stateoftheart monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.

This patented, single element transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

MPX4250D Maximum Ratings

Rating	Symbol	Value	Unit
Overpressure⁽²⁾ (P1 > P2)	P_max	400	kPa
Burst Pressure⁽²⁾ (P1> P2)	P_burst	1000	kPa
Storage Temperature	T_stg	40 to +125	°C
Operating Temperature	T_A	40 to +125	°C

1. T_C= 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

MPX4250D Features

• Differential and Gauge Applications Only
• 1.4% Maximum Error Over 0° to 85°C
• Ideally suited for Microprocessor Interfacing
• Patented Silicon Shear Stress Strain Gauge
• Temperature Compensated Over 40° to +125°C
• Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
• Durable Epoxy Unibody Element

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