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• Low Cost • Patented piezoresistive strain gauge implant, temperature compensation and calibration all integrated on a single, monolithic sensor die. • Pressure Range Available: 0300 mmHg • Polysulfone (Mindell S1000) Case Material (Medical, Class VI Approved)
MPX2300DT1 Parameters
Technical/Catalog Information
MPX2300DT1
Vendor
Freescale Semiconductor
Category
Sensors, Transducers
Operating Pressure
*
Voltage - Rated
*
Output
*
Package / Case
4-SIP ChipPak
Pressure Type
*
Features
*
Interface
*
Pressure Port
*
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
MPX2300DT1 MPX2300DT1
MPX2300DT1 General Description
Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a submodule component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Motorola's unique sensor die with its patented, piezoresistive implant technology, along with the added feature of onchip, thinfilm temperature compensation and calibration.
MPX2300DT1 Maximum Ratings
Rating
Symbol
Value
Unit
Overpressure (Backside)
Pmax
125
PSI
Burst Pressure
Pburst
100
kPa
Supply Voltage
VSmax
10
Vdc
Storage Temperature
Tstg
25 to +85
Operating Temperature
TA
+15 to +40
MPX2300DT1 Features
• Low Cost • Patented piezoresistive strain gauge implant, temperature compensation and calibration all integrated on a single, monolithic sensor die. • Pressure Range Available: 0300 mmHg • Polysulfone (Mindell S1000) Case Material (Medical, Class VI Approved)