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These devices are designed primarily for VHF band switching applications but are also suitable for use in generalpurpose switching circuits. They are supplied in a costeffective plastic package for economical, highvolume consumer and industrial requirements. They are also available in surface mount
MPN3700 Features
• Long Reverse Recovery Time trr = 300 ns (Typ) • Rugged PIN Structure Coupled with Wirebond Construction for Optimum Reliability • Low Series Resistance @ 100 MHz RS = 0.7 Ohms (Typ) @ IF = 10 mAdc • Reverse Breakdown Voltage = 200 V (Min)
MPN3700 Typical Application
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.