MKT370, MKT373, MKT7822NFK100VDCA Selling Leads, Datasheet
MFG:PHI Package Cooled:SOP D/C:9907
MKT370, MKT373, MKT7822NFK100VDCA Datasheet download
Part Number: MKT370
MFG: PHI
Package Cooled: SOP
D/C: 9907
MKT370, MKT373, MKT7822NFK100VDCA
- Table of contents:
Info of MKT370
Info of MKT373
Info of MKT7822NFK100VDCA
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About MKT370
PDF/DataSheet Download
Datasheet: MKT370
File Size: 2068252 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About MKT373
PDF/DataSheet Download
Datasheet: MKT373
File Size: 2068252 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About MKT1804
PDF/DataSheet Download
Datasheet: MKT1804
File Size: 57001 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
MKT370 Features
• Low-inductive wound cell of metallized (PETP) film
• Potted with epoxy resin in a flame-retardant case
• Radial leads of solder-coated wire
• Withstands solvents and rinsing liquids
• Small stand-off pips to allow removal of solder flux
• Suitable for high density packaging.
• Potted with epoxy resin in a flame-retardant case
• Radial leads of solder-coated wire
• Withstands solvents and rinsing liquids
• Small stand-off pips to allow removal of solder flux
• Suitable for high density packaging.
MKT370 Typical Application
• Blocking and coupling
• Bypass and energy reservoir.
• Bypass and energy reservoir.
MKT373 Features
• Low-inductive wound cell of metallized (PETP) film
• Potted with epoxy resin in a flame-retardant case
• Radial leads of solder-coated wire
• Withstands solvents and rinsing liquids
• Small stand-off pips to allow removal of solder flux
• Suitable for high density packaging.
• Potted with epoxy resin in a flame-retardant case
• Radial leads of solder-coated wire
• Withstands solvents and rinsing liquids
• Small stand-off pips to allow removal of solder flux
• Suitable for high density packaging.
MKT373 Typical Application
• Blocking and coupling
• Bypass and energy reservoir.
• Bypass and energy reservoir.
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