MGW30N60, MGY40N60, MGYF1-LX714AF Selling Leads, Datasheet
MFG:ON Package Cooled:09+ D/C:TO

MGW30N60, MGY40N60, MGYF1-LX714AF Datasheet download
Part Number: MGW30N60
MFG: ON
Package Cooled: 09+
D/C: TO
MFG:ON Package Cooled:09+ D/C:TO
MGW30N60, MGY40N60, MGYF1-LX714AF Datasheet download
MFG: ON
Package Cooled: 09+
D/C: TO
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PDF/DataSheet Download
Datasheet: MGW30N60
File Size: 219651 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MGY40N60
File Size: 210545 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MGY20N120D
File Size: 260884 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
Rating | Symbol | Value | Unit |
CollectorEmitter Voltage | VCES | 600 | Vdc |
CollectorGate Voltage (RGE = 1.0 MW) | VCGR | 600 | Vdc |
GateEmitter Voltage - Continuous | VGE | ±20 | Vdc |
Collector Current - Continuous @ TC = 25°C - Continuous @ TC = 90°C - Repetitive Pulsed Current (1) |
IC25 IC90 ICM |
66 40 132 |
Adc Apk |
Total Power Dissipation @ TC = 25°C Derate above 25°C |
PD | 260 2.08 |
Watts W/°C |
Operating and Storage Junction Temperature Range | TJ, Tstg | 55 to 150 | °C |
Short Circuit Withstand Time (VCC = 360 Vdc, VGE = 15 Vdc, RG = 20 W) |
tsc | 10 | s |
Thermal Resistance - Junction to Case IGBT Thermal Resistance - Junction to Ambient |
RqJC RqJA |
0.48 35 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 5 seconds | TL | 260 | °C |
Mounting Torque, 632 or M3 screw | 10 lbfin (1.13 Nm) |
Rating | Symbol | Value | Unit |
CollectorEmitter Voltage | VCES | 600 | Vdc |
CollectorGate Voltage (RGE = 1.0 MW) | VCGR | 600 | Vdc |
GateEmitter Voltage - Continuous | VGE | ±20 | Vdc |
Collector Current - Continuous @ TC = 25°C - Continuous @ TC = 90°C - Repetitive Pulsed Current (1) |
IC25 IC90 ICM |
66 40 132 |
Adc Apk |
Total Power Dissipation @ TC = 25°C Derate above 25°C |
PD | 260 2.08 |
Watts W/°C |
Operating and Storage Junction Temperature Range | TJ, Tstg | 55 to 150 | °C |
Short Circuit Withstand Time (VCC = 360 Vdc, VGE = 15 Vdc, RG = 20 W) |
tsc | 10 | s |
Thermal Resistance - Junction to Case IGBT Thermal Resistance - Junction to Ambient |
RqJC RqJA |
0.48 35 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 5 seconds | TL | 260 | °C |
Mounting Torque, 632 or M3 screw | 10 lbfin (1.13 Nm) |