K40263238A-GC45, K40263238E-GC36, K404 Selling Leads, Datasheet
MFG:SAMSUNG Package Cooled:BGA D/C:05+
K40263238A-GC45, K40263238E-GC36, K404 Datasheet download
Part Number: K40263238A-GC45
MFG: SAMSUNG
Package Cooled: BGA
D/C: 05+
MFG:SAMSUNG Package Cooled:BGA D/C:05+
K40263238A-GC45, K40263238E-GC36, K404 Datasheet download
MFG: SAMSUNG
Package Cooled: BGA
D/C: 05+
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PDF/DataSheet Download
Datasheet: K401
File Size: 211152 KB
Manufacturer: KODENSHI [KODENSHI KOREA CORP.]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K401
File Size: 211152 KB
Manufacturer: KODENSHI [KODENSHI KOREA CORP.]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K404
File Size: 211152 KB
Manufacturer: KODENSHI [KODENSHI KOREA CORP.]
Download : Click here to Download
Parameter | Symbol | Rating | Unit | |
Input | Forward current | IF | ±50 | mA |
Peak forward current*1 | IFP | ±1 | A | |
Power dissipation | PD | 70 | mW | |
Junction Temperature | TJ | 125 | ||
Output | Collector-Emitter Breakdown Voltage | BVCEO | 30 | V |
Emitter-Collector Breakdown Voltage | BVECO | 5 | V | |
Collector current | IC | 50 | mA | |
Collector power dissipation | PC | 150 | mW | |
Total power dissipation | Ptot | 250 | mW | |
Input to Output Isolation Voltage*2 | Viso | AC3750 | Vrms | |
Operating temperature | Topr | -30 to +85 | ||
Storage temperature | Tstg | -55 to +125 | ||
Lead Soldering Temperature*3 | Tsol | 260 |