JP503R, JP503S, JP506 Selling Leads, Datasheet
MFG:ANAREN Package Cooled:SMD D/C:08+
JP503R, JP503S, JP506 Datasheet download
Part Number: JP503R
MFG: ANAREN
Package Cooled: SMD
D/C: 08+
JP503R, JP503S, JP506
- Table of contents:
Info of JP503R
Info of JP503S
Info of JP506
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About JP503
PDF/DataSheet Download
Datasheet: JP503
File Size: 326762 KB
Manufacturer: Anaren Microwave
Download : Click here to Download
About JP503
PDF/DataSheet Download
Datasheet: JP503
File Size: 326762 KB
Manufacturer: Anaren Microwave
Download : Click here to Download
About JP503
PDF/DataSheet Download
Datasheet: JP503
File Size: 326762 KB
Manufacturer: Anaren Microwave
Download : Click here to Download
JP503S General Description
The JP503S Pico Xinger is a low profile, miniature 3dB hybrid coupler in an easy to use surface mount package designed for W-CDMA and other 3G applications. The JP503S is designed for balanced amplifiers, variable phase shifters and attenuators, LNAs, signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates.
JP503S Features
` 2.0 2.3 GHz.
` 3G Frequencies
` Low Loss
` High Isolation
` 90o Quadrature
` Surface Mountable
` Tape And Reel
` New Pico-Package
` Lead Free
` 100% Tested
` 3G Frequencies
` Low Loss
` High Isolation
` 90o Quadrature
` Surface Mountable
` Tape And Reel
` New Pico-Package
` Lead Free
` 100% Tested
JP506 General Description
The JP506 is a low profile 6dB directional coupler in an easy to use surface mount package covering the WCDMA and other 3G applications. The JP506 is ideal for an inline split/combine amplifiers and for power injection and can be used in most high power designs. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates such as FR4, G-10 and polyamide.
JP506 Features
• 2.0 - 2.3GHz
• Low loss
• High Directivity
• Surface Mountable
• Tape And Reel
• Convenient Package
• 100% Tested
• Low loss
• High Directivity
• Surface Mountable
• Tape And Reel
• Convenient Package
• 100% Tested
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