IRGCH40SE, IRGCH50FE, IRGCH50KE Selling Leads, Datasheet
MFG:IR Package Cooled:N/A D/C:2010+
IRGCH40SE, IRGCH50FE, IRGCH50KE Datasheet download
Part Number: IRGCH40SE
MFG: IR
Package Cooled: N/A
D/C: 2010+
MFG:IR Package Cooled:N/A D/C:2010+
IRGCH40SE, IRGCH50FE, IRGCH50KE Datasheet download
MFG: IR
Package Cooled: N/A
D/C: 2010+
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Datasheet: IRGCH40SE
File Size: 18906 KB
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Datasheet: IRGCH50FE
File Size: 19328 KB
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PDF/DataSheet Download
Datasheet: IRGCH50KE
File Size: 19322 KB
Manufacturer:
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IRGCH50FE is a kind of IGBT die in wafer form.
What comes next is about the electrical characteristics (wafer form). The maximum VCE (on) (Collector-to-Emitter Saturation Voltage) is 3.5 V at IC=20 A, TJ=25, VGE=15 V. The minimum V(BR)CES (Colletor-to-Emitter Breakdown Voltage) is 1200 V at TJ=25, ICES=250A, VGE=0 V. The minimum VGE(th) (Gate Threshold Voltage) is 3.0 V and the maximum is 5.5 V at VGE=VCE, TJ=25, IC=250A. The maximum ICES (Zero Gate Voltage Collector Current) is 250A at TJ=25, VCE=1200 V. The maximum IGES (Gate-to-Emitter Leakage Current) is ± 500 nA at TJ=25, VGE=±20 V.
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