IRGBC40K-S, IRGBC40M, IRGBC40M-S Selling Leads, Datasheet
MFG:IR Package Cooled:TO-263 D/C:06+
IRGBC40K-S, IRGBC40M, IRGBC40M-S Datasheet download
Part Number: IRGBC40K-S
MFG: IR
Package Cooled: TO-263
D/C: 06+
MFG:IR Package Cooled:TO-263 D/C:06+
IRGBC40K-S, IRGBC40M, IRGBC40M-S Datasheet download
MFG: IR
Package Cooled: TO-263
D/C: 06+
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Datasheet: IRGBC40K-S
File Size: 115819 KB
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Datasheet: IRGBC40M
File Size: 38095 KB
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Datasheet: IRGBC40M-S
File Size: 90753 KB
Manufacturer: IRF [International Rectifier]
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Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors,while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, high-current applications.
These new short circuit rated devices are especially suited for motor control and other applications requiring short circuit withstand capability.
Parameter |
Max. |
Units | |
VCES | Collector-to-Emitter Voltage |
600 |
V |
IC @ TC = 25°C | Continuous Collector Current |
42 |
A |
IC @ TC = 100°C | Continuous Collector Current |
25 | |
ICM | Pulsed Collector Current |
84 | |
ILM | Clamped Inductive Load Current |
84 | |
tsc | Short Circuit Withstand Time |
10 |
s |
VGE | Gate-to-Emitter Voltage |
±20 |
V |
EARV | Reverse Voltage Avalanche Energy |
15 |
mJ |
PD @ TC = 25°C | Maximum Power Dissipation |
160 |
W |
PD @ TC = 100°C | Maximum Power Dissipation |
65 | |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
°C
|
Soldering Temperature, for 10 seconds |
300 (0.063 in. (1.6mm) from case) | ||
Mounting torque, 6-32 or M3 screw. |
10 lbf`in (1.1N`m) |
Parameter |
Typ. |
Max. |
Units | |
RJC | Junction-to-Case |
- |
0.77 |
°C/W |
RJA | Junction-to-Ambient, (PCB Mount)** |
- |
40 | |
RJA | Junction-to-Ambient, typical socket mount |
- |
80 | |
Wt | Weight |
2.0 (0.07) |
- |
g(oz) |
Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications. Description
Parameter |
Max. |
Units | |
Collector-to-Emitter Voltage |
V DSS |
600 |
A
|
Continuous Drain Current |
I D |
40 | |
Power Dissipation |
I DM |
24 | |
Clamped Inductive Load Current |
P D |
80 |
Ω |
Short Circuit Withstand Time |
R DS(ON) |
80 |
W/K ? |
Gate-to-Emitter Voltage |
C ISS |
10 |
V |
Reverse Voltage Avalanche Energy |
Q g |
15 |
mJmW |
Maximum Power Dissipation |
t td(on) |
96g |
ns |
Operating Junction and Storage Temperature Range |
t tr |
-55 to +150 | |
TurnOff Delay Time |
t td(off) |
50 | |
Fall Time |
t f |
Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications.
These new short circuit rated devices are especially suited for motor control and other applications requiring short circuit withstand capability.
Parameter |
Max. |
Units | |
VCES | Collector-to-Emitter Voltage |
600 |
V |
IC @ TC = 25°C | Continuous Collector Current |
40 |
A |
IC @ TC =100°C | Continuous Collector Current |
24 | |
ICM | Pulsed Collector Current |
80 | |
ILM | Clamped Inductive Load Current |
80 | |
tsc | Short Circuit Withstand Time |
10 |
s |
VGE | Gate-to-Emitter Voltage |
±20 |
V |
EARV | Reverse Voltage Avalanche Energy |
15 |
mJ |
PD @ TC = 25°C | Maximum Power Dissipation |
160 |
W |
PD @ TC =100°C | Maximum Power Dissipation |
65 | |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to +150 |
°C |
Soldering Temperature, for 10 sec. |
300 (0.063 in. (1.6mm) from case) | ||
Mounting torque, 6-32 or M3 screw. |
10 lbf•in (1.1N•m) |