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•Parallel Operation for Higher Current Applications •Lower Conduction Losses and Switching Losses •Higher Switching Frequency up to 150kHz
IRGB20B60PD1 Maximum Ratings
Parameter
Max.
Units
VCES
Collector-to-Emitter Voltage
600
V
IF@ TC= 25°
CContinuous Collector Current
40
A
IF@ TC= 100°
CContinuous Collector Current
22
A
ICM
Pulsed Collector Current
80
A
ICM
Clamped Inductive Load Current
80
A
IF@ TC= 25°
CDiode Continuous Forward Current
10
A
IF@ TC= 100°
CDiode Continuous Forward Current
4
A
LSM
Diode Maximum Forward Current
16
A
VGE
Gate-to-Emitter Voltage
± 20
V
PD@ TC= 25°
CMaximum Power Dissipation
156
W
PD@ TC= 100°
CMaximum Power Dissipation
215
W
TJ TSTG
Operating Junction and
Storage Temperature Range
-55 to +150
°C
Soldering Temperature, for 10 sec.
300 (0.063 in. (1.6mm) from case)
IRGB20B60PD1 Features
•NPT Technology, Positive Temperature Coefficient •Lower VCE(SAT) •Lower Parasitic Capacitances •Minimal Tail Current •HEXFRED Ultra Fast Soft-Recovery Co-Pack Diode •Tighter Distribution of Parameters •Higher Reliability
IRGB20B60PD1 Typical Application
•Telecom and Server SMPS •PFC and ZVS SMPS Circuits •Uninterruptable Power Supplies •Consumer Electronics Power Supplies
IRGB20B60PD1PBF Parameters
Technical/Catalog Information
IRGB20B60PD1PBF
Vendor
International Rectifier
Category
Discrete Semiconductor Products
Input Type
Standard
Voltage - Collector Emitter Breakdown (Max)
600V
Current - Collector (Ic) (Max)
40A
Vce(on) (Max) @ Vge, Ic
2.8V @ 15V, 20A
Power - Max
215W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Packaging
Tube
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
IRGB20B60PD1PBF IRGB20B60PD1PBF
IRGB20B60PD1PBF Maximum Ratings
Parameter
Max.
Units
VCES
Collector-to-Emitter Voltage
600
IC @ TC = 25
Continuous Collector Current
40
A
IC @ TC = 100
Continuous Collector Current
22
ICM
Pulse Collector Current (Ref. Fig. C.T.4)
80
ILM
Clamped Inductive Load Current
80
IF @ TC = 25
Diode Continous Forward Current
10
IF @ TC = 100
Diode Continous Forward Current
4
IFRM
Maximum Repetitive Forward Current
16
VGE
Gate-to-Emitter Voltage
±20
V
PD @ TC = 25
Maximum Power Dissipation
215
W
PD @ TC = 100
Maximum Power Dissipation
86
TJ TSTG
Operating Junction and Storage Temperature Range
-55 to +150
Soldering Temperature, for 10 sec.
300 (1.6mm from case )
Mounting torque, 6-32 or M3 srew
10 lbf`in (1.1N`m)
IRGB20B60PD1PBF Features
• NPT Technology, Positive Temperature Coefficient • Lower VCE(SAT) • Lower Parasitic Capacitances • Minimal Tail Current • HEXFRED Ultra Fast Soft-Recovery Co-Pack Diode • Tighter Distribution of Parameters • Higher Reliability
IRGB20B60PD1PBF Typical Application
• Telecom and Server SMPS • PFC and ZVS SMPS Circuits • Uninterruptable Power Supplies • Consumer Electronics Power Supplies • Lead-Free
IRGB30B60K Maximum Ratings
Parameter
Max.
Units
VCES
Collector-to-Emitter Voltage
600
V
IC @ TC = 25°C
Continuous Collector Current
78
A
IC @ TC = 100°C
Continuous Collector Current
50
ICM
Pulse Collector Current(Ref.Fig.C.T.5)
120
ILM
Clamped Inductive Load current
120
VISOL
RMS Isolation Voltage, Terminal to Case, t=1 min.
2500
V
VGE
Gate-to-Emitter Voltage
±20
PD @ TC = 25°C
Maximum Power Dissipation
370
W
PD @ TC = 100°C
Maximum Power Dissipation
180
TJ TSTG
Operating Junction and Storage Temperature Range
-55 to +175
°C
Soldering Temperature, for 10 sec.
300(0.063 in.(1.6mm)fromcase)
Mounting Torque, 6-32 or M3 Screw
10 lbf`in (1.1 N`m)
IRGB30B60K Features
• Low VCE (on) Non Punch Through IGBT Technology. • 10µs Short Circuit Capability. • Square RBSOA. • Positive VCE (on) Temperature Coefficient. • Maximum Junction Temperature rated at 175°C.