HX2000, HX2019NL, HX2040

The HX2000 and HX2000r gate arrays are performance oriented sea-of-transistor arrays, fabricated on Honeywell's RICMOS™ IV Silicon On Insulator (SOI) process.

The HX2000 arrays are for 5V designs only. The HX2000r arrays support 5V and 3.3V operation. High density is achieved with the standard 3-layer metal or optional 4-layer metal process, providing up to 290,000 usable gates. The high density and performance characteristics of the RICMOS (Radiation Insensitive CMOS) SOI process make possible device operation beyond 100 MHz over the full military temperature range, even after exposure to ionizing radiation exceeding 1x106 rad(SiO2). Flip- Flops have been designed for a Soft Error Rate (SER) of less than 1x10-11 errors/bit/day in the Adams 90% worst case environment.

Each HX2000/HX2000r design is founded on our proven RICMOS ASIC library of SSI and MSI logic elements,configurable RAM cells, and selectable I/O pads. The gate arrays feature a global clock network capable of handling multiple clock signals with low clock skew between registers.

This family is fully compatible with Honeywell's high reliability screening procedures and consistent with QML Class Q and V requirements. Designers can choose from a wide variety of I/O types.

Output buffer options include 8 drive strengths, CMOS/TTL levels, IEEE 1149.1 boundary scan, pull-up/pull-down resistors, and three-state capability. Input buffers can be selected for CMOS/TTL/Schmitt trigger levels, IEEE 1149.1 boundary scan and pull-up/pull-down resistors.Bi-directional buffers are also available.

An important feature of HX2000r is the dual voltage I/O capability in which the designer has complete flexibility in terms of placement of I/O buffers. This feature allows adjacent I/O buffers with different supply voltages.

The HX2000/HX2000r families provide options for configurable multi-port SRAMs. Word widths can be selected in single bit increments. A variety of SRAM read and write port options are available to serve most applications. Custom drop-in macrocells can also be implemented to further increase chip density. Word widths can be selected in two bit increments. Single port and two port options are available.

The HX2000/HX2000r families have a special feature to allow a chip level power down mode, in which the associated buses connected to the chip can remain active. This high impedance off-state buffer feature allows users to power down portions of their system for power savings or for cold sparing.

Logic designers need not have prior experience in radiation hardening. Honeywell's VDS™ Toolkit and RICMOS IV SOI libraries provide the necessary guidance to achieve first pass design success. The VDS Toolkit supports industry standard platforms including those offered by Mentor Graphics and Synopsys.

Honeywell can perform design translations to the HX2000 arrays from other CAD platforms. Our synthesis capabilities allow customers to use familiar CAD tools and libraries to map existing designs to Honeywell library components.

The HX2000 family of gate arrays is the right choice for your high reliability applications demanding high density and radiation performance. To learn more about Honeywell's variety of space components, call us at 612-954-2888.

The HX2019NL id designed as one of the power over ethernet (PoE) magnetics 10/100base-TX VoIP magnetics modules.

It has four features. (1) RoHS-5 peak reflow temperature rating 235°C. (2) RoHS-6 peak reflow temperature rating 245°C. (3) IEEE 802.3af / ANSI X3.263 compliant performance. (4) Designed for IP phone or switch applications. That are all the main features.

Some electrical specifications at 25°C unless otherwise specified have been concluded into several points as follow. (1) Its operating temperature range would be from 0°C to 70°C. (2) It would be RoHS-6 compliant. The difference between RoHS-6 and RoHS-5 is that RoHS-6: product does not contain 5 out of the 6 banned substances specified in the RoHS directive. Some internal connections may contain lead in high-temperature solder (solder alloys containing more than 85% lead). RoHS-5: Product does not contain 5 out of the 6 banned substances specified in the RoHS directive (product contains lead in applications considered solder). (3) Its  ports would be 1. (4) Its insertion loss would be -1.4dB max from 1 to 100MHz. (5) Its return loss at 100 would be min -16dB from 1 to 30MHz and would be min -14dB at 40MHz and would be min -13dB at 50MHz and would be min -12dB from 60 to 80MHz. (6) Its crosstalk would be min -45dB at 30MHz and would be min -40dB at 60MHz and would be min -35dB at 100MHz. (7) Its hipot would be min 1500Vrms. (8) Its DC resistance balance would be max 3.5%. It should ne noted that when ordering Tape & Reel packaging, add the suffix "T" to the end of the part number. For example: H2008NLT.

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