HSU276, HSU276TRF, HSU277 Selling Leads, Datasheet
MFG:HITACHI Package Cooled:5266+ D/C:05+
HSU276, HSU276TRF, HSU277 Datasheet download
Part Number: HSU276
MFG: HITACHI
Package Cooled: 5266+
D/C: 05+
HSU276, HSU276TRF, HSU277
- Table of contents:
Info of HSU276
Info of HSU276TRF
Info of HSU277
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About HSU276
PDF/DataSheet Download
Datasheet: HSU276
File Size: 25354 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
About HSU119
PDF/DataSheet Download
Datasheet: HSU119
File Size: 27396 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
About HSU277
PDF/DataSheet Download
Datasheet: HSU277
File Size: 28623 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
HSU276 Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Reverse voltage |
VR |
3 |
V |
| Average rectified current |
IO |
30 |
mA |
| Storage temperature |
Tj |
125 |
|
| Operation temperature |
Tstg |
55 to 125 |
HSU276 Features
· High forward current, Low capacitance.
· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.
· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.
HSU276 Connection Diagram
HSU277 Maximum Ratings
|
Item |
Symbol |
Value |
Unit |
| Reverse voltage |
VR |
35 |
V |
| Peak forward current |
IFM |
150 |
mW |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
55 to +125 |
|
| Operation temperature |
Topr |
20 to 60 |
HSU277 Features
` Low forward resistance. (rf = 0.7W max)
` U ltra small R esin P ackage (URP) is suitable for surface mount design.
` U ltra small R esin P ackage (URP) is suitable for surface mount design.
HSU277 Connection Diagram
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