HMC-MDB171, HMC-MDB172, HMC-MDB207 Selling Leads, Datasheet
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC-MDB171, HMC-MDB172, HMC-MDB207 Datasheet download
Part Number: HMC-MDB171
MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
HMC-MDB171, HMC-MDB172, HMC-MDB207
- Table of contents:
Info of HMC-MDB171
Info of HMC-MDB172
Info of HMC-MDB207
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About HMC1001
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
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About HMC1001
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
About HMC1001
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
HMC-MDB171 General Description
The HMC-MDB171 is a monolithic I/Q Mixer which can be used as either an image reject mixer (IRM) or a single sideband upconverter. This passive MMIC mixer is fabricated with GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology. For downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. The HMC-MDB171 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
HMC-MDB171 Maximum Ratings
| Maximum Channe Temperature |
180 |
| Storage Temperature |
-65 to 150 |
| Operating Temperature |
-55 to 85 |
HMC-MDB171 Features
Wide IF Bandwidth: DC - 5 GHz
High Image Rejection: 25 dB
High LO to RF Isolation
Passive: No DC Bias Required
Die Size: 1.5 x 2.0 x 0.1 mm
High Image Rejection: 25 dB
High LO to RF Isolation
Passive: No DC Bias Required
Die Size: 1.5 x 2.0 x 0.1 mm
HMC-MDB171 Typical Application
This HMC-MDB171 is ideal for:
• Point-to-Point Radios
• Military Radar, ECM & EW
• Test & Measurement Equipment
• SATCOM
• Sensors
• Point-to-Point Radios
• Military Radar, ECM & EW
• Test & Measurement Equipment
• SATCOM
• Sensors
HMC-MDB172 General Description
The HMC-MDB172 is a monolithic I/Q Mixer which can be used as either an image reject mixer (IRM) or a single sideband upconverter. This passive MMIC is fabricated with GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology. For downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation.
The HMC-MDB172 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
HMC-MDB172 Maximum Ratings
Storage Temperature.. -65 to 150
Operating Temperature ..-55 to 85
Operating Temperature ..-55 to 85
HMC-MDB172 Features
·Wide IF Bandwidth: DC - 5 GHz
·High Image Rejection: 25 dB
·High LO to RF Isolation: 35 dB
·Passive: No DC Bias Required
·Die Size: 2.2 x 2.0 x 0.1 mm
·High Image Rejection: 25 dB
·High LO to RF Isolation: 35 dB
·Passive: No DC Bias Required
·Die Size: 2.2 x 2.0 x 0.1 mm
HMC-MDB172 Typical Application
• Point-to-Point Radios
• VSAT
• Military Radar, ECM & EW
• Test & Measurement Equipment
• SATCOM
• VSAT
• Military Radar, ECM & EW
• Test & Measurement Equipment
• SATCOM
HMC-MDB207 General Description
The HMC-MDB207 is a monolithic I/Q Mixer which can be used as either an image reject mixer (IRM) or a single sideband upconverter. This passive MMIC mixer utilizes two double balanced mixer cells and a 90 degree hybrid. It is fabricated with GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology. For downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. The HMC-MDB207 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. This compact MMIC is a much smaller and more consistent alternative to hybrid style Image Reject Mixers and Single Sideband Upconverter assemblies. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
HMC-MDB207 Maximum Ratings
| LO Drive Storage Temperature Operating Temperature |
20 dBm -65 to 150 -55 to 85 |
HMC-MDB207 Features
·Wide IF Bandwidth: DC - 3 GHz
·High Image Rejection: 30 dB
·High LO to RF Isolation: 30 dB
·Passive: No DC Bias Required
·Die Size: 2.0×1.2×0.1 mm
·High Image Rejection: 30 dB
·High LO to RF Isolation: 30 dB
·Passive: No DC Bias Required
·Die Size: 2.0×1.2×0.1 mm
HMC-MDB207 Typical Application
·Point-to-Point Radios
·Military Radar, ECM & EW
·Test & Measurement Equipment
·SATCOM
·Sensors
·Military Radar, ECM & EW
·Test & Measurement Equipment
·SATCOM
·Sensors
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