HF50A060ACE, HF50ACB201209, HF50ACB201209T Selling Leads, Datasheet
MFG:86200 Package Cooled:06+ D/C:09+
HF50A060ACE, HF50ACB201209, HF50ACB201209T Datasheet download
Part Number: HF50A060ACE
MFG: 86200
Package Cooled: 06+
D/C: 09+
MFG:86200 Package Cooled:06+ D/C:09+
HF50A060ACE, HF50ACB201209, HF50ACB201209T Datasheet download
MFG: 86200
Package Cooled: 06+
D/C: 09+
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Datasheet: HF50A060ACE
File Size: 15768 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: HF50-12
File Size: 19395 KB
Manufacturer: ASI [Advanced Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HF50-12
File Size: 19395 KB
Manufacturer: ASI [Advanced Semiconductor]
Download : Click here to Download
The HF50A060ACE has some electrical characteristics (wafer form).When parameter is VFM,the description is forward voltage,the guaranteed (Min/Max) is 1.2V Max.,the test conditions is TJ = 25,IF = 10.0A.When parameter is BVR,the description is reverse breakdown voltage,the guaranteed (Min/Max) is 600V Min.,the test conditions is TJ = 25,IR = 200A.When parameter is IRM,the description is reverse leakage current,the guaranteed (Min/Max) is 25A Max.,the test conditions is TJ = 25,VR = 600V.
The HF50A060ACE has some mechanical data.The nominal back metal composition,thickness is Cr-Ni-Ag(1 KA - 4 KA - 6 KA).The nominal front metal composition,thickness is 99% Al, 1% Si (3 microns).The chip dimensions is 0.257" x 0.257" .The wafer diameter is 125mm,with std.< 100 > flat.The wafer thickness is .015" ± .003".The relevant die mechanical dwg. number is 01-5171.The minimum street width is 100 microns.The reject ink dot size is 0.25 mm diameter minimum.The recommended storage environment is storage in original container, in dessicated nitrogen, with no contamination.
At present there is not too much information about this model.If you are willing to find more about HF50A060ACE,please pay attention to our web! We will promptly update the relevant information.
• This extensive series completely covers impedance values ranging from 7 to 125 [100MHz] and can be applied to a wide range of circuits.
• The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30 materials. The most suitable component can be selected for the circuit pattern and the suppression band.
• These components are applicable for both flow and reflow solderings, and have outstanding physical characteristics such as excellent terminal strength, body strength, resistance to soldering heat, solderability and mounting reliability.