HF06-4-710, HF-065125-2, HF06A060ACE Selling Leads, Datasheet
MFG:TOKO Package Cooled:07+ D/C:07+
HF06-4-710, HF-065125-2, HF06A060ACE Datasheet download
Part Number: HF06-4-710
MFG: TOKO
Package Cooled: 07+
D/C: 07+
HF06-4-710, HF-065125-2, HF06A060ACE
- Table of contents:
Info of HF06-4-710
Info of HF-065125-2
Info of HF06A060ACE
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About HF03D060ACE
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Datasheet: HF03D060ACE
File Size: 29367 KB
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About HF-122
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Datasheet: HF-122
File Size: 114869 KB
Manufacturer: Sirenza Microdevices
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About HF06A060ACE
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Datasheet: HF06A060ACE
File Size: 16294 KB
Manufacturer:
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HF06A060ACE General Description
The HF06A060ACE has some electrical characteristics (wafer form).When parameter is VFM,the description is forward voltage,the guaranteed (Min/Max) is 1.8V Max.,the test conditions is TJ = 25,IF = 4.0A.When parameter is BVR,the description is reverse breakdown voltage,the guaranteed (Min/Max) is 600V Min.,the test conditions is TJ = 25,IR = 200A.When parameter is IRM,the description is reverse leakage current,the guaranteed (Min/Max) is 3A Max.,the test conditions is TJ = 25,VR = 600V.
The HF06A060ACE has some mechanical data.The nominal back metal composition,thickness is Cr-Ni-Ag(1 KA - 4 KA - 6 KA).The nominal front metal composition,thickness is 99% Al,1% Si (3 microns).The chip dimensions is 0.066" x 0.066" .The wafer diameter is 125mm,with std.< 100 > flat.The wafer thickness is .015" ± .003".The relevant die mechanical dwg. number is 01-5158.The minimum street width is 100 microns.The reject ink dot size is 0.25 mm diameter minimum.The recommended storage environment is storage in original container, in dessicated nitrogen, with no contamination.
At present there is not too much information about this model.If you are willing to find more about HF06A060ACE,please pay attention to our web! We will promptly update the relevant information.
HF06A060ACE Maximum Ratings
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